NTTD1P02R2
Power MOSFET
−1.45 Amps, −20 Volts
P−Channel Enhancement Mode
Dual Micro8t Package
http://onsemi.com
Features
−1.45 AMPERES
−20 VOLTS
160 mW @ VGS = −4.5
• Ultra Low R
DS(on)
• Higher Efficiency Extending Battery Life
• Logic Level Gate Drive
• Miniature Dual Micro8 Surface Mount Package
• Diode Exhibits High Speed, Soft Recovery
• Micro8 Mounting Information Provided
• Pb−Free Package is Available
Dual P−Channel
D
Applications
• Power Management in Portable and Battery−Powered Products,
i.e.: Computers, Printers, PCMCIA Cards, Cellular and Cordless
Telephones
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
MARKING DIAGRAM &
Rating
Symbol
Value
Unit
PIN ASSIGNMENT
D1 D1 D2 D2
Drain−to−Source Voltage
V
DSS
−20
V
V
8
Gate−to−Source Voltage − Continuous
V
GS
"8.0
8
Thermal Resistance −
Junction−to−Ambient (Note 1)
R
250
0.50
−1.45
−1.15
−10
°C/W
W
q
P
D
D
D
JA
WW
1
Total Power Dissipation @ T = 25°C
A
BCG
Continuous Drain Current @ T = 25°C
I
A
A
A
Micro8
G
Continuous Drain Current @ T = 70°C
I
A
CASE 846A
STYLE 2
Pulsed Drain Current (Note 3)
I
A
DM
1
Thermal Resistance −
S1 G1 S2 G2
Junction−to−Ambient (Note 2)
R
125
1.0
−2.04
−1.64
−16
°C/W
W
q
JA
Total Power Dissipation @ T = 25°C
P
D
A
BC
WW
G
= Specific Device Code
= Work Week
= Pb−Free Package
Continuous Drain Current @ T = 25°C
I
I
A
A
A
D
D
Continuous Drain Current @ T = 70°C
A
Pulsed Drain Current (Note 3)
I
A
DM
Operating and Storage
Temperature Range
T , T
−55 to
+150
°C
(Note: Microdot may be in either location)
J
stg
ORDERING INFORMATION
Single Pulse Drain−to−Source Avalanche
EAS
35
mJ
Energy − Starting T = 25°C
J
(V = −20 Vdc, V = −4.5 Vdc,
DD
GS
†
Device
Package
Shipping
Peak I = −3.5 Apk, L = 5.6 mH,
L
R
= 25 W)
G
NTTD1P02R2
Micro8
4000/Tape & Reel
4000/Tape & Reel
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
T
L
260
°C
NTTD1P02R2G
Micro8
(Pb−Free)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Minimum FR−4 or G−10 PCB, Steady State.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
2. Mounted onto a 2” square FR−4 Board
(1 in sq, 2 oz Cu 0.06″ thick single sided), Steady State.
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
March, 2006 − Rev. 2
NTTD1P02R2/D