NTTD4401F
FETKYtPower MOSFET
and Schottky Diode
−20 V, −3.3 A P−Channel with 20 V,
1.0 A Schottky Diode, Micro8t Package
The FETKY product family incorporates low RDS(on), true logic
level MOSFETs packaged with industry leading, low forward drop, low
leakage Schottky Barrier Diodes to offer high efficiency components in
a space saving configuration. Independent pinouts for TMOS and
Schottky die allow the flexibility to use a single component for
switching and rectification functions in a wide variety of applications.
http://onsemi.com
MOSFET PRODUCT SUMMARY
V
R
Typ
DS(on)
I
Max
(BR)DSS
D
70 mW @ −4.5 V
100 mW @ −2.7 V
−3.3 A
−2.7 A
−20 V
Features
• Low V and Low Leakage Schottky Diode
• Lower Component Placement and Inventory Costs along with Board
Space Savings
F
SCHOTTKY DIODE SUMMARY
V
R
Max
I Max
F
V Max
F
20 V
2.0 A
600 mV @ I = 2.0 A
• Logic Level Gate Drive – Can be Driven by Logic ICs
F
Applications
A
• Buck Converter
S
• Synchronous Rectification
• Low Voltage Motor Control
• Load Management in Battery Packs, Chargers, Cell Phones, and
G
other Portable Products
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
D
C
Rating
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
Value
−20
−10
3.3
Unit
V
V
DSS
P−Channel MOSFET
SCHOTTKY DIODE
V
GS
V
Continuous Drain
Current (Note 1)
I
D
A
T = 25°C
8
A
Micro8
CASE 846A
T = 100°C
A
2.1
1
Power Dissipation
(Note 1)
Steady T = 25°C
State
P
1.42
W
A
A
D
MARKING DIAGRAM
& PIN CONNECTIONS
Continuous Drain
Current (Note 2)
I
D
T = 25°C
A
2.4
1.5
T = 100°C
A
ANODE
1
2
8
7
6
5
CATHODE
CATHODE
Power Dissipation
(Note 2)
Steady T = 25°C
P
D
0.78
W
A
A
ANODE
State
YWW
BG
SOURCE
GATE
DRAIN
DRAIN
3
4
Pulsed Drain
Current
t = 10 ms
I
10
−55 to 150
150
DM
Operating Junction and Storage
Temperature
T , T
°C
mJ
J
STG
(Top View)
= Year
Y
Single Pulse Drain−to−Source
Avalanche Energy
EAS
WW = Work Week
BG = Device Code
Starting T = 25°C (t v 10 s)
A
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
ORDERING INFORMATION
Device
NTTD4401FR2
Package
Shipping†
4000/Tape & Reel
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
Micro8
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. Surface−mounted on FR4 board using 1 inch sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface−mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.172 in sq).
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
August, 2004 − Rev. 3
NTTD4401F/D