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NTTD4401FR2G PDF预览

NTTD4401FR2G

更新时间: 2024-02-17 18:20:22
品牌 Logo 应用领域
安森美 - ONSEMI 晶体肖特基二极管小信号场效应晶体管开关光电二极管
页数 文件大小 规格书
8页 86K
描述
Power MOSFET and Schottky Diode

NTTD4401FR2G 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete包装说明:LEAD FREE, CASE 846A-02, MICRO-8
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99Factory Lead Time:1 week
风险等级:5.22Is Samacsys:N
其他特性:LOGIC LEVEL COMPATIBLE配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):2.4 A
最大漏极电流 (ID):2.4 A最大漏源导通电阻:0.09 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):175 pF
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):1.42 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTTD4401FR2G 数据手册

 浏览型号NTTD4401FR2G的Datasheet PDF文件第2页浏览型号NTTD4401FR2G的Datasheet PDF文件第3页浏览型号NTTD4401FR2G的Datasheet PDF文件第4页浏览型号NTTD4401FR2G的Datasheet PDF文件第5页浏览型号NTTD4401FR2G的Datasheet PDF文件第6页浏览型号NTTD4401FR2G的Datasheet PDF文件第7页 
NTTD4401F  
FETKYt Power MOSFET  
and Schottky Diode  
−20 V, 3.3 A P−Channel with 20 V,  
1.0 A Schottky Diode, Micro8t Package  
http://onsemi.com  
The FETKY product family incorporates low R  
, true logic level  
DS(on)  
MOSFET PRODUCT SUMMARY  
MOSFETs packaged with industry leading, low forward drop, low  
leakage Schottky Barrier Diodes to offer high efficiency components in  
a space saving configuration. Independent pinouts for TMOS and  
Schottky die allow the flexibility to use a single component for  
switching and rectification functions in a wide variety of applications.  
V
R
DS(on)  
Typ  
I
Max  
(BR)DSS  
D
70 mW @ −4.5 V  
100 mW @ −2.7 V  
−3.3 A  
−2.7 A  
−20 V  
Features  
SCHOTTKY DIODE SUMMARY  
Low V and Low Leakage Schottky Diode  
F
V
Max  
I
Max  
V Max  
F
R
F
Lower Component Placement and Inventory Costs along with Board  
Space Savings  
20 V  
2.0 A  
600 mV @ I = 2.0 A  
F
A
S
Logic Level Gate Drive – Can be Driven by Logic ICs  
Pb−Free Package is Available  
Applications  
Buck Converter  
G
Synchronous Rectification  
Low Voltage Motor Control  
D
P−Channel MOSFET  
C
Load Management in Battery Packs, Chargers, Cell Phones, and  
other Portable Products  
Schottky Diode  
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
MARKING DIAGRAM &  
PIN ASSIGNMENT  
Rating  
Drain−to−Source Voltage  
Gate−to−Source Voltage  
Symbol  
Value  
−20  
−10  
3.3  
Unit  
V
V
DSS  
C C D D  
8
V
V
GS  
8
Continuous Drain  
Current (Note 1)  
T = 25°C  
I
A
A
D
T = 100°C  
A
2.1  
WW  
BG G  
G
1
Power Dissipation  
(Note 1)  
Steady T = 25°C  
P
1.42  
W
A
A
D
D
State  
Micro8  
CASE 846A  
Continuous Drain  
Current (Note 2)  
T = 25°C  
A
I
2.4  
1.5  
D
1
T = 100°C  
A
A A S G  
Power Dissipation  
(Note 2)  
Steady T = 25°C  
P
0.78  
W
A
A
BG  
WW  
G
= Specific Device Code  
= Work Week  
= Pb−Free Package  
State  
Pulsed Drain  
Current  
t = 10 ms  
I
10  
DM  
(Note: Microdot may be in either location)  
Operating Junction and  
T , T  
−55 to  
150  
°C  
mJ  
°C  
J
STG  
Storage Temperature  
Single Pulse Drain−to−Source Avalanche  
EAS  
150  
ORDERING INFORMATION  
Energy Starting T = 25°C (t v 10 s)  
A
Device  
Package  
Shipping  
Lead Temperature for Soldering Purposes  
T
L
260  
(1/8from case for 10 s)  
NTTD4401FR2  
Micro8  
4000/Tape & Reel  
4000/Tape & Reel  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface−mounted on FR4 board using 1 in sq pad size  
(Cu area = 1.127 in sq [1 oz] including traces).  
Micro8  
(Pb−Free)  
NTTD4401FR2G  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
2. Surface−mounted on FR4 board using the minimum recommended pad size  
(Cu area = 0.172 in sq).  
©
Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
January, 2007 − Rev. 5  
NTTD4401F/D  
 

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