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NTTFD1D8N02P1E PDF预览

NTTFD1D8N02P1E

更新时间: 2023-09-03 20:29:28
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
11页 497K
描述
MOSFET, Power, 25V Dual N-Channel Power Clip

NTTFD1D8N02P1E 数据手册

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MOSFET - Power, N-Channel  
PowerTrench[ Power Clip  
25 V Asymmetric Dual  
NTTFD1D8N02P1E  
Features  
Small Footprint (3.3mm x 3.3mm) for Compact Design  
www.onsemi.com  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
These Devices are PbFree and are RoHS Compliant  
FET  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
Typical Applications  
DCDC Converters  
System Voltage Rails  
4.2 mW @ 10 V  
5.3 mW @ 4.5 V  
1.4 mW @ 10 V  
1.8 mW @ 4.5 V  
Q1  
25 V  
61 A  
Q2  
25 V  
126 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
GatetoSource Voltage  
Symbol  
Q1  
Q2  
Unit  
V
V
DSS  
25  
25  
ELECTRICAL CONNECTION  
V
GS  
+16  
12  
+16  
12  
V
Continuous Drain  
Current R  
I
61  
44  
25  
126  
91  
A
T
T
= 25°C  
= 85°C  
D
C
q
JC  
Steady  
(Note 3)  
C
State  
Power Dissipation  
P
36  
W
A
D
D
D
T
A
= 25°C  
R
(Note 3)  
q
JC  
Continuous Drain  
Current R  
I
D
15  
11  
30  
21  
T
A
= 25°C  
= 85°C  
MARKING  
DIAGRAM  
q
JA  
T
A
Steady  
State  
(Notes 1, 3)  
Power Dissipation  
P
I
1.6  
2.0  
W
A
T
A
= 25°C  
R
(Notes 1, 3)  
q
JA  
Continuous Drain  
Current R  
11  
8
21  
15  
T
A
= 25°C  
= 85°C  
D
q
JA  
T
A
Steady  
State  
(Notes 2, 3)  
Power Dissipation  
P
0.8  
0.9  
W
T
A
= 25°C  
R
(Notes 2, 3)  
q
JA  
2EMN = Specific Device Code  
A
Y
WW  
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Assembly Lot Code  
Pulsed Drain Current  
T
= 25°C, t = 10 ms  
I
DM  
483  
861  
A
A
p
Single Pulse DraintoSource Avalanche  
E
AS  
37.3 150.  
1
mJ  
Energy  
Q1: I = 15.8 A , L = 0.3 mH (Note 4)  
L
pk  
Q2: I = 31.63 A , L = 0.3 mH (Note 4)  
L
pk  
Operating Junction and Storage Temperature T , T  
55 to + 150  
°C  
°C  
J
stg  
ORDERING INFORMATION  
Lead Temperature for Soldering  
T
L
260  
Purposes (1/8from case for 10 s)  
Device  
Package  
Shipping  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
NTTFD1D8N02P1E  
PQFN8  
(PbFree)  
3000 / Tape &  
Reel  
2
1. Surfacemounted on FR4 board using a 1 in pad size, 2 oz. Cu pad.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
2. Surfacemounted on FR4 board using minimum pad size, 2 oz. Cu pad.  
3. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
Actual continuous current will be limited by thermal & electromechanical  
application board design. R  
is determined by the user’s board design.  
q
JC  
4. Q1 100% UIS tested at L = 0.1 mH, IAS = 24.2 A.  
Q2 100% UIS tested at L = 0.1 mH, IAS = 48.1 A.  
5. This device does not have ESD protection diode.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
February, 2020 Rev. 1  
NTTFD1D8N02P1E/D  
 

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