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NTTFS002N04CLTAG PDF预览

NTTFS002N04CLTAG

更新时间: 2024-11-01 11:09:35
品牌 Logo 应用领域
安森美 - ONSEMI 脉冲光电二极管晶体管
页数 文件大小 规格书
9页 359K
描述
功率 MOSFET,40 V,2.2mOhm,142A,单 N 沟道

NTTFS002N04CLTAG 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, S-PDSO-F3Reach Compliance Code:compliant
Factory Lead Time:13 weeks风险等级:5.75
雪崩能效等级(Eas):268 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:40 V
最大漏极电流 (Abs) (ID):28 A最大漏极电流 (ID):28 A
最大漏源导通电阻:0.0035 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):47 pFJESD-30 代码:S-PDSO-F3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):85 W最大脉冲漏极电流 (IDM):706 A
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICONBase Number Matches:1

NTTFS002N04CLTAG 数据手册

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NTTFS002N04CL  
MOSFET – Power, Single,  
N-Channel  
40 V, 2.2 mW, 142 A  
Features  
www.onsemi.com  
Small Footprint (3.3 x 3.3 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
These Devices are PbFree and are RoHS Compliant  
2.2 mW @ 10 V  
3.5 mW @ 4.5 V  
40 V  
142 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
NChannel  
D (5 8)  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
142  
80  
A
C
D
q
JC  
T
C
(Notes 1, 2, 3, 4)  
Steady  
State  
Power Dissipation  
T
C
P
85  
W
A
G (4)  
D
R
(Notes 1, 2, 3)  
q
JC  
T
C
= 100°C  
27  
S (1, 2, 3)  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
28  
q
JA  
T = 100°C  
A
20  
(Notes 1, 3, 4)  
Steady  
State  
MARKING DIAGRAM  
Power Dissipation  
T = 25°C  
A
P
3.2  
1.6  
706  
W
D
1
R
(Notes 1, 3)  
q
JA  
S
S
S
G
D
D
D
D
T = 100°C  
A
1
XXXX  
AYWWG  
G
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
WDFN8  
(m8FL)  
CASE 511DY  
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
70.4  
268  
A
S
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 10.2 A)  
L(pk)  
WW  
G
= Work Week  
= PbFree Package  
(Note: Microdot may be in either location)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Parameter  
Symbol  
Value  
1.8  
Unit  
JunctiontoCase Steady State (Note 3)  
JunctiontoAmbient Steady State (Note 3)  
R
°C/W  
q
JC  
R
46.5  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Psi (Y) is used as required per JESD5112 for packages in which  
substantially less than 100% of the heat flows to single case surface.  
2
3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
4. Continuous DC current rating. Maximum current for pulses as long as 1  
second is higher but is dependent on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
June, 2019 Rev. 0  
NTTFS002N04CL/D  
 

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