NTTD2P02R2
Power MOSFET
-2.4 Amps, -20 Volts
Dual P–Channel Micro8
Features
• Ultra Low R
DS(on)
http://onsemi.com
• Higher Efficiency Extending Battery Life
• Logic Level Gate Drive
• Miniature Micro–8 Surface Mount Package
• Diode Exhibits High Speed, Soft Recovery
• Micro8 Mounting Information Provided
–2.4 AMPERES
–20 VOLTS
R
= 90 mW
DS(on)
Applications
• Power Management in Portable and Battery–Powered Products, i.e.:
Cellular and Cordless Telephones and PCMCIA Cards
P–Channel
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Symbol
Value
Unit
Drain–to–Source Voltage
V
–20
V
V
DSS
Gate–to–Source Voltage – Continuous
V
"8.0
GS
G
Thermal Resistance –
Junction–to–Ambient (Note 1.)
R
P
D
I
I
160
0.78
–2.4
–1.92
–20
°C/W
W
A
A
A
θJA
S
Total Power Dissipation @ T = 25°C
A
Continuous Drain Current @ T = 25°C
A
D
D
Continuous Drain Current @ T = 70°C
A
MARKING
Pulsed Drain Current (Note 3.)
I
DM
DIAGRAM
Thermal Resistance –
Junction–to–Ambient (Note 2.)
Total Power Dissipation @ T = 25°C
Continuous Drain Current @ T = 25°C
Continuous Drain Current @ T = 70°C
Pulsed Drain Current (Note 3.)
8
R
P
D
I
I
88
1.42
–3.25
–2.6
–30
°C/W
W
A
A
A
θJA
A
1
A
A
D
D
YWW
BE
Micro8
CASE 846A
STYLE 2
I
DM
T , T
Operating and Storage
Temperature Range
–55 to
+150
°C
J
stg
Single Pulse Drain–to–Source Avalanche
E
AS
350
mJ
Energy – Starting T = 25°C
Y
= Year
J
(V
= –20 Vdc, V
= –4.5 Vdc,
WW
BE
= Work Week
= Device Code
DD
GS
Peak I = –5.0 Apk, L = 28 mH,
L
R
= 25 Ω)
G
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
T
L
260
°C
PIN ASSIGNMENT
1. Minimum FR–4 or G–10 PCB, Steady State.
2. Mounted onto a 2″ square FR–4 Board (1″ sq. 2 oz Cu 0.06″ thick single
sided), Steady State.
Source 1
1
8
7
Drain 1
Drain 1
Drain 2
Drain 2
2
Gate 1
Source 2
Gate 2
3
4
6
5
3. Pulse Test: Pulse Width ꢀ 300 ms, Duty Cycle ꢀ 2%.
Top View
ORDERING INFORMATION
Device
Package
Shipping
4000/Tape & Reel
NTTD2P02R2
Micro8
Semiconductor Components Industries, LLC, 2000
1
Publication Order Number:
December, 2000 – Rev. 0
NTTD2P02R2/D