NTMD4184PF
Power MOSFET and
Schottky Diode
-30 V, -4.0 A, Single P-Channel with 20 V,
2.2ꢀA, Schottky Barrier Diode
Features
•ꢀFETKYt Surface Mount Package Saves Board Space
http://onsemi.com
•ꢀIndependent Pin-Out for MOSFET and Schottky Allowing for
Design Flexibility
P-CHANNEL MOSFET
•ꢀLow R
MOSFET and Low V Schottky to Minimize
F
V
R
Max
DS(on)
DS(on)
I Max
D
(BR)DSS
Conduction Losses
95 mW @ -10 V
-30 V
-4.0 A
•ꢀOptimized Gate Charge to Minimize Switching Losses
165 mW @ -4.5 V
•ꢀThis is a Pb-Free Device
Applications
SCHOTTKY DIODE
•ꢀDisk Drives
•ꢀDC-DC Converters
•ꢀPrinters
V
Max
V Max
F
I Max
F
R
20 V
0.58 V
2.2 A
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
A
S
Rating
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain
Symbol
Value
-30
20
Unit
V
V
DSS
V
GS
V
T = 25°C
I
D
-3.3
-2.6
1.6
A
G
A
Current R
(Note 1)
q
JA
T = 70°C
A
Power Dissipation
(Note 1)
T = 25°C
A
P
D
W
A
D
C
R
q
JA
P-Channel MOSFET
Schottky Diode
Continuous Drain
Current R (Note 2)
T = 25°C
A
I
D
-2.3
-1.8
0.77
q
JA
T = 70°C
A
Steady
State
MARKING DIAGRAM
& PIN ASSIGNMENT
Power Dissipation
(Note 2)
T = 25°C
A
P
I
W
A
D
R
q
JA
Continuous Drain
Current R
(Note 1)
T = 25°C
A
-4.0
-3.2
2.31
D
C
C D D
t < 10 s
q
JA
8
T = 70°C
A
4184PF
AYWW
G
SOIC-8
CASE 751
STYLE 18
Power Dissipation
t < 10 s (Note 1)
T = 25°C
A
P
D
W
A
8
R
q
JA
1
1
Pulsed Drain Current
T = 25°C,
A
t = 10 ms
I
-10
DM
A
A S G
p
Operating Junction and Storage Temperature
Source Current (Body Diode)
T , T
J
-55 to
+150
°C
STG
4184PF = Device Code
A
= Assembly Location
= Year
= Work Week
Y
I
S
-1.3
260
A
WW
G
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
°C
= Pb-Free Package
SCHOTTKY MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
ORDERING INFORMATION
Peak Repetitive Reverse Voltage
DC Blocking Voltage
V
20
20
V
V
A
RRM
V
†
R
Device
NTMD4184PFR2G
Package
Shipping
Average Rectified Forward
Current, (Note 1)
Steady
State
I
F
2.2
SOIC-8 2500/Tape & Reel
(Pb-Free)
t < 10 s
3.2
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©ꢀ Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 0
1
Publication Order Number:
NTMD4184PF/D