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NTMD4840NR2G PDF预览

NTMD4840NR2G

更新时间: 2024-02-13 21:16:32
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 132K
描述
Power MOSFET 30 V, 7.5 A, Dual N−Channel, SOIC−8

NTMD4840NR2G 技术参数

是否无铅: 不含铅生命周期:Active
零件包装代码:SOT包装说明:LEAD FREE, CASE 751-07, SOIC-8
针数:8Reach Compliance Code:unknown
风险等级:5.37配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):4.5 A
最大漏源导通电阻:0.024 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
湿度敏感等级:NOT SPECIFIED元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:COMMERCIAL
表面贴装:YES端子面层:TIN
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTMD4840NR2G 数据手册

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NTMD4840N  
Power MOSFET  
30 V, 7.5 A, Dual NChannel, SOIC8  
Features  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
Dual SOIC8 Surface Mount Package Saves Board Space  
This is a PbFree Device  
http://onsemi.com  
V
R
Max  
DS(on)  
I
Max  
(BR)DSS  
D
24 mW @ 10 V  
36 mW @ 4.5 V  
30 V  
7.5 A  
Applications  
Disk Drives  
DCDC Converters  
Printers  
NChannel  
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Rating  
DraintoSource Voltage  
GatetoSource Voltage  
Continuous Drain  
Symbol  
Value  
30  
Unit  
V
V
DSS  
V
GS  
20  
V
I
D
A
G
T = 25°C  
5.5  
A
Current R  
(Note 1)  
q
JA  
T = 70°C  
A
4.4  
Power Dissipation  
(Note 1)  
T = 25°C  
P
1.14  
W
A
A
D
R
S
q
JA  
Continuous Drain  
Current R (Note 2)  
I
D
T = 25°C  
A
4.5  
3.5  
q
JA  
T = 70°C  
A
MARKING DIAGRAM  
& PIN ASSIGNMENT  
Steady  
State  
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
I
0.68  
W
A
D
R
q
JA  
D1 D1 D2 D2  
8
Continuous Drain  
T = 25°C  
A
7.5  
6.0  
D
Current R  
(Note 1)  
t < 10 s  
q
JA  
T = 70°C  
A
4840N  
AYWW  
G
SOIC8  
CASE 751  
STYLE 11  
8
Power Dissipation  
t < 10 s (Note 1)  
T = 25°C  
A
P
D
1.95  
W
A
1
R
q
JA  
1
Pulsed Drain Current  
T = 25°C,  
t = 10 ms  
I
30  
A
p
DM  
S1 G1 S2 G2  
4840N = Device Code  
Operating Junction and Storage Temperature  
T , T  
55 to  
°C  
J
STG  
A
= Assembly Location  
+150  
Y
= Year  
Source Current (Body Diode)  
I
S
2.0  
28  
A
WW  
G
= Work Week  
= PbFree Package  
Single Pulse DraintoSource Avalanche  
EAS  
mJ  
Energy T = 25°C, V = 30 V, V = 10 V,  
J
DD  
GS  
I = 7.5 A , L = 1.0 mH, R = 25 W  
L
pk  
G
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
ORDERING INFORMATION  
Device  
Package  
Shipping  
THERMAL RESISTANCE RATINGS  
Rating  
Symbol  
Max  
110  
64  
Unit  
NTMD4840NR2G  
SOIC8  
(PbFree)  
2500/Tape & Reel  
JunctiontoAmbient – Steady State (Note 1)  
JunctiontoAmbient – t10 s (Note 1)  
JunctiontoFOOT (Drain)  
R
q
JA  
R
q
JA  
°C/W  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
R
40  
q
JF  
JunctiontoAmbient – Steady State (Note 2)  
R
183.5  
q
JA  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surfacemounted on FR4 board using 1 inch sq pad size, 1 oz Cu.  
2. Surfacemounted on FR4 board using the minimum recommended pad size.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
September, 2009 Rev. 1  
NTMD4840N/D  
 

NTMD4840NR2G 替代型号

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