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NTMFD0D9N02P1E PDF预览

NTMFD0D9N02P1E

更新时间: 2024-09-27 11:15:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
11页 506K
描述
功率 Mosfet,30/25V,POWERTRENCH® Power Clip

NTMFD0D9N02P1E 数据手册

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NTMFD0D9N02P1E  
MOSFET – Power, Dual,  
N-Channel, Power Trench,  
Power Clip, Asymmetric  
30ꢀV / 25 V  
www.onsemi.com  
Features  
Small Footprint (5x6mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
FET  
V
R
MAX  
I MAX  
D
DS(on)  
(BR)DSS  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
3.0 mW @ 10 V  
3.8 mW @ 4.5 V  
0.72 mW @ 10 V  
0.95 mW @ 4.5 V  
G
Q1  
30 V  
77 A  
Designed with Low Rg for Fast Switching Applications  
These are Pbfree, Halogen Free / BFR Free and are RoHS  
Q2  
25 V  
180 A  
Compliant  
Typical Applications  
DCDC Converters  
PIN1  
System Voltage Rails  
General Purpose Point of Load  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Sym-  
bol  
Parameter  
DraintoSource Voltage  
Q1  
Q2  
Unit  
V
PQFN8  
POWER CLIP  
CASE 483AR  
V
DSS  
30  
25  
GatetoSource Voltage  
V
GS  
+16V +16V  
12V 12V  
V
MARKING DIAGRAM  
Continuous Drain Cur- Steady  
T
T
= 25°C  
= 85°C  
I
D
77  
56  
180  
130  
A
C
rent R  
(Note 3)  
State  
q
JC  
C
&Z&3&K  
2EGN  
Power Dissipation  
(Note 3)  
T = 25°C  
P
29.2 37.4  
W
A
A
D
D
D
R
q
JC  
Continuous Drain Cur- Steady  
rent R (Note 1, 3)  
State  
T = 25°C  
A
I
D
21  
15  
44  
32  
&Z  
&3  
&K  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
q
JA  
T = 85°C  
A
Power Dissipation  
(Note 1, 3)  
T = 25°C  
A
P
2.1  
2.3  
W
A
2EGN = Specific Device Code  
R
q
JA  
Continuous Drain Cur- Steady  
rent R (Note 2, 3)  
State  
T = 25°C  
A
I
D
14  
10  
30  
21  
ELECTRICAL CONNECTION  
q
JA  
T = 85°C  
A
Power Dissipation  
(Note 2, 3)  
T = 25°C  
A
P
0.96 1.04  
W
R
q
JA  
Pulsed Drain Current T = 25°C, t = 10 ms  
I
DM  
356 1023  
A
A
p
Single Pulse DraintoSource Avalanche  
Energy Q1: I = 10 A , L = 3 mH (Note 4)  
E
AS  
150  
600  
mJ  
L
pk  
Energy Q2: I = 20 A , L = 3 mH (Note 4)  
L
pk  
Operating Junction and Storage Temperature  
T ,  
stg  
55 to 150  
°C  
°C  
J
ORDERING INFORMATION  
T
Device  
NTMFD0D9N02P1E  
Package  
Shipping  
Lead Temperature Soldering Reflow for Sol-  
dering Purposes (1/8from case for 10 s)  
T
L
260  
PQFN8  
(PbFree)  
3000 / Tape &  
Reel  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
May, 2019 Rev. 0  
NTMFD0D9N02P1E/D  

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