NTMFD0D9N02P1E
MOSFET – Power, Dual,
N-Channel, Power Trench,
Power Clip, Asymmetric
30ꢀV / 25 V
www.onsemi.com
Features
• Small Footprint (5x6mm) for Compact Design
• Low R
to Minimize Conduction Losses
FET
V
R
MAX
I MAX
D
DS(on)
(BR)DSS
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
3.0 mW @ 10 V
3.8 mW @ 4.5 V
0.72 mW @ 10 V
0.95 mW @ 4.5 V
G
Q1
30 V
77 A
• Designed with Low Rg for Fast Switching Applications
• These are Pb−free, Halogen Free / BFR Free and are RoHS
Q2
25 V
180 A
Compliant
Typical Applications
• DC−DC Converters
PIN1
• System Voltage Rails
• General Purpose Point of Load
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Sym-
bol
Parameter
Drain−to−Source Voltage
Q1
Q2
Unit
V
PQFN8
POWER CLIP
CASE 483AR
V
DSS
30
25
Gate−to−Source Voltage
V
GS
+16V +16V
−12V −12V
V
MARKING DIAGRAM
Continuous Drain Cur- Steady
T
T
= 25°C
= 85°C
I
D
77
56
180
130
A
C
rent R
(Note 3)
State
q
JC
C
&Z&3&K
2EGN
Power Dissipation
(Note 3)
T = 25°C
P
29.2 37.4
W
A
A
D
D
D
R
q
JC
Continuous Drain Cur- Steady
rent R (Note 1, 3)
State
T = 25°C
A
I
D
21
15
44
32
&Z
&3
&K
= Assembly Plant Code
= Numeric Date Code
= Lot Code
q
JA
T = 85°C
A
Power Dissipation
(Note 1, 3)
T = 25°C
A
P
2.1
2.3
W
A
2EGN = Specific Device Code
R
q
JA
Continuous Drain Cur- Steady
rent R (Note 2, 3)
State
T = 25°C
A
I
D
14
10
30
21
ELECTRICAL CONNECTION
q
JA
T = 85°C
A
Power Dissipation
(Note 2, 3)
T = 25°C
A
P
0.96 1.04
W
R
q
JA
Pulsed Drain Current T = 25°C, t = 10 ms
I
DM
356 1023
A
A
p
Single Pulse Drain−to−Source Avalanche
Energy Q1: I = 10 A , L = 3 mH (Note 4)
E
AS
150
600
mJ
L
pk
Energy Q2: I = 20 A , L = 3 mH (Note 4)
L
pk
Operating Junction and Storage Temperature
T ,
stg
−55 to 150
°C
°C
J
ORDERING INFORMATION
T
†
Device
NTMFD0D9N02P1E
Package
Shipping
Lead Temperature Soldering Reflow for Sol-
dering Purposes (1/8″ from case for 10 s)
T
L
260
PQFN8
(Pb−Free)
3000 / Tape &
Reel
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
May, 2019 − Rev. 0
NTMFD0D9N02P1E/D