NTMD6N04R2
Power MOSFET
40 V, 5.8 A, Dual N-Channel SOIC-8
Features
•ꢀDesigned for use in low voltage, high speed switching applications
•ꢀUltra Low On-Resistance Provides
http://onsemi.com
Higher Efficiency and Extends Battery Life
ꢁ- R
ꢁ- R
= 0.027 W, V = 10 V (Typ)
GS
= 0.034 W, V = 4.5 V (Typ)
DS(on)
DS(on)
V
DSS
R
DS(ON)
Typ
I Max
D
GS
40 V
27 mW @ V = 10 V
GS
5.8 A
•ꢀMiniature SOIC-8 Surface Mount Package Saves Board Space
•ꢀDiode is Characterized for Use in Bridge Circuits
•ꢀDiode Exhibits High Speed, with Soft Recovery
•ꢀPb-Free Package is Available
N-Channel
D
D
Applications
•ꢀDC-DC Converters
•ꢀComputers
G
G
•ꢀPrinters
•ꢀCellular and Cordless Phones
•ꢀDisk Drives and Tape Drives
S
S
MARKING DIAGRAM &
PIN ASSIGNMENT
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Symbol
Value
Unit
D1 D1 D2 D2
8
Drain-to-Source Voltage
V
DSS
40
V
V
8
Gate-to-Source Voltage - Continuous
Drain Current (Note 1)
V
GS
"20
1
E6N04
AYWWꢀG
G
SOIC-8
CASE 751
STYLE 11
- Continuous @ T = 25°C
I
D
5.8
29
Adc
Apk
A
- Single Pulse (tp ≤ 10 ms)
I
DM
1
Drain Current (Note 2)
- Continuous @ T = 25°C
I
D
4.6
Adc
S1 G1 S2 G2
A
Total Power Dissipation
@ T = 25°C (Note 1)
P
D
W
E6N04 = Specific Device Code
A
2.0
1.29
A
= Assembly Location
= Year
@ T = 25°C (Note 2)
A
Y
WW
Operating and Storage Temperature
Range
T , T
J
-55 to +150
245
°C
stg
= Work Week
= Pb-Free Package
G
(Note: Microdot may be in either location)
Single Pulse Drain-to-Source Avalanche
Energy - Starting T = 25°C
E
AS
mJ
J
(V = 40 Vdc, V = 5.0 Vdc,
DD GS
Vdc, Peak I = 7.0 Apk,
L
L = 10 mH, R = 25 W)
ORDERING INFORMATION
G
Thermal Resistance
- Junction-to-Ambient (Note 1)
- Junction-to-Ambient (Note 2)
R
°C/W
°C
q
†
JA
Device
NTMD6N04R2G
Package
Shipping
2500/Tape & Reel
62.5
97
SOIC-8
(Pb-Free)
Maximum Lead Temperature for
Soldering Purposes for 10 Sec
T
260
L
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1″ pad size, t ≤ 10 s
2. When surface mounted to an FR4 board using 1″ pad size, t = steady state
©ꢀ Semiconductor Components Industries, LLC, 2007
December, 2007 - Rev. 0
1
Publication Order Number:
NTMD6N04R2/D