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NTMFD4C820NT1G PDF预览

NTMFD4C820NT1G

更新时间: 2024-11-24 21:12:39
品牌 Logo 应用领域
安森美 - ONSEMI 开关脉冲光电二极管晶体管
页数 文件大小 规格书
12页 183K
描述
Power Field-Effect Transistor

NTMFD4C820NT1G 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-F8Reach Compliance Code:compliant
风险等级:5.76雪崩能效等级(Eas):16 mJ
外壳连接:DRAIN SOURCE配置:SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):12 A
最大漏极电流 (ID):9.1 A最大漏源导通电阻:0.0108 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):125 pF
JESD-30 代码:R-PDSO-F8元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1.88 W
最大脉冲漏极电流 (IDM):55 A表面贴装:YES
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTMFD4C820NT1G 数据手册

 浏览型号NTMFD4C820NT1G的Datasheet PDF文件第2页浏览型号NTMFD4C820NT1G的Datasheet PDF文件第3页浏览型号NTMFD4C820NT1G的Datasheet PDF文件第4页浏览型号NTMFD4C820NT1G的Datasheet PDF文件第5页浏览型号NTMFD4C820NT1G的Datasheet PDF文件第6页浏览型号NTMFD4C820NT1G的Datasheet PDF文件第7页 
NTMFD4C820N  
Dual N-Channel Power  
MOSFET  
30 V, High Side 18 A / Low Side 27 A, Dual  
NChannel SO8FL  
www.onsemi.com  
Features  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
CoPackaged Power Stage Solution to Minimize Board Space  
Minimized Parasitic Inductances  
7.3 mW @ 10 V  
10.8 mW @ 4.5 V  
3.4 mW @ 10 V  
5.2 mW @ 4.5 V  
Q1 Top FET  
30 V  
18 A  
27 A  
Optimized Devices to Reduce Power Losses  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Q2 Bottom  
FET  
Compliant  
30 V  
Applications  
D1  
(2, 3, 4, 9)  
DCDC Converters  
System Voltage Rails  
Point of Load  
(1) G1  
S1/D2 (10)  
(8) G2  
S2 (5, 6, 7)  
PIN CONNECTIONS  
D1 4  
5 S2  
6 S2  
7 S2  
8 G2  
D1 3  
D1 2  
G1 1  
9
D1  
10  
S1/D2  
(Bottom View)  
MARKING  
DIAGRAM  
1
DFN8  
4C20N  
CASE 506BX  
AYWZZ  
1
4C20N = Specific Device Code  
A
Y
= Assembly Location  
= Year  
W
ZZ  
= Work Week  
= Lot Traceability  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
June, 2019 Rev. 0  
NTMFD4C820N/D  

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