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NTMFD5C680NLT1G PDF预览

NTMFD5C680NLT1G

更新时间: 2023-09-03 20:30:19
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 212K
描述
双 N 沟道,功率 MOSFET,60V,26A,28mΩ

NTMFD5C680NLT1G 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Dual  
N-Channel  
60 V, 28 mW, 26 A  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
28 mW @ 10 V  
41 mW @ 4.5 V  
60 V  
26 A  
NTMFD5C680NL  
Dual NChannel  
Features  
D1  
D2  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
G
G1  
G2  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
S1  
S2  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
MARKING  
DIAGRAM  
V
DSS  
D1 D1  
GatetoSource Voltage  
V
GS  
20  
V
S1  
G1  
S2  
G2  
D1  
1
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
20  
A
C
D
D1  
D2  
D2  
XXXXXX  
AYWZZ  
DFN8 5x6  
(SO8FL)  
CASE 506BT  
q
JC  
T
C
15  
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T
C
P
24  
W
A
D
D2 D2  
R
(Notes 1, 2)  
q
JC  
T
C
= 100°C  
12  
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceability  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
7.4  
5.5  
3.2  
1.6  
66  
q
JA  
T = 100°C  
A
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
W
D
R
(Notes 1 & 2)  
q
JA  
T = 100°C  
A
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
20  
47  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 5 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
6.27  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
46.6  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
February, 2022 Rev. P4  
NTMFD5C680NL/D  
 

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