DATA SHEET
www.onsemi.com
MOSFET - Power, Dual
N-Channel
60 V, 28 mW, 26 A
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
28 mW @ 10 V
41 mW @ 4.5 V
60 V
26 A
NTMFD5C680NL
Dual N−Channel
Features
D1
D2
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
• Low Q and Capacitance to Minimize Driver Losses
DS(on)
G
G1
G2
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
S1
S2
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
MARKING
DIAGRAM
V
DSS
D1 D1
Gate−to−Source Voltage
V
GS
20
V
S1
G1
S2
G2
D1
1
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
20
A
C
D
D1
D2
D2
XXXXXX
AYWZZ
DFN8 5x6
(SO8FL)
CASE 506BT
q
JC
T
C
15
(Notes 1, 2, 3)
Steady
State
Power Dissipation
T
C
P
24
W
A
D
D2 D2
R
(Notes 1, 2)
q
JC
T
C
= 100°C
12
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
Continuous Drain
Current R
T = 25°C
A
I
D
7.4
5.5
3.2
1.6
66
q
JA
T = 100°C
A
(Notes 1, 2, 3)
Steady
State
Power Dissipation
T = 25°C
A
P
W
D
R
(Notes 1 & 2)
q
JA
T = 100°C
A
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
Operating Junction and Storage Temperature
T , T
−55 to
+175
°C
J
stg
Source Current (Body Diode)
I
20
47
A
S
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (I
= 5 A)
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
6.27
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
46.6
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
February, 2022 − Rev. P4
NTMFD5C680NL/D