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NTMFS0D7N04XLT1G PDF预览

NTMFS0D7N04XLT1G

更新时间: 2023-09-03 20:36:01
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 221K
描述
Power MOSFET, Single, N-Channel, 40V, 0.7mΩ, 349A, SO8-FL 5x6

NTMFS0D7N04XLT1G 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – Power, Single  
N-Channel, Logic Level,  
SO8FL  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
0.7 mW @ 10 V  
1.1 mW @ 4.5 V  
40 V  
349 A  
40 V, 0.7 mW, 349 A  
D (5)  
NTMFS0D7N04XL  
Features  
Low R  
G (4)  
to Minimize Conduction Loss  
DS(on)  
Low Q with Soft Recovery to Minimize E Loss and Voltage  
RR  
RR  
S (1,2,3)  
NCHANNEL MOSFET  
Spike  
Low Q and Capacitance to Minimize Driving and Switching Loss  
G
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
MARKING  
DIAGRAM  
Typical Applications  
High Switching Frequency DCDC Conversion  
Synchronous Rectification  
S
S
S
G
DFN5 (SO8FL)  
CASE 488AA  
0D7N4L  
AYWZZ  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
1
J
D
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
0D7N4L = Specific Device Code  
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceabililty  
V
DSS  
GatetoSource Voltage  
DC  
V
GS  
20  
V
Continuous Drain Current  
(Note 2)  
T
= 25°C  
= 100°C  
= 25°C  
= 100°C  
= 25°C,  
I
349  
247  
167  
83  
A
C
C
C
D
T
C
Power Dissipation (Note 2)  
T
P
W
A
D
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 6 of this data sheet.  
T
C
Pulsed Drain Current  
T
I
1667  
1667  
DM  
t = 100 ms  
p
Pulsed Source Current  
(Body Diode)  
I
SM  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
STG  
Source Current (Body Diode)  
I
256  
470  
A
S
Single Pulse Avalanche Energy (I = 97 A)  
(Note 3)  
E
AS  
mJ  
PK  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. Surfacemounted on FR4 board using 1 in pad size, 1 oz Cu pad.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
3. E of 470 mJ is based on started T = 25°C, I = 97 A, V = 32 V,  
AS  
GS  
q
J
AS  
DD  
V
4. R  
= 10 V, 100% avalanche tested.  
Thermal Resistance Junction to Case Top = 20 °C/W.  
JCT  
© Semiconductor Components Industries, LLC, 2023  
1
Publication Order Number:  
June, 2023 Rev. 2  
NTMFS0D7N04XL/D  
 

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