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NTMFS0D5N03CT1G PDF预览

NTMFS0D5N03CT1G

更新时间: 2023-09-03 20:39:56
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 193K
描述
MOSFET, Power, Single N-Channel, 30V, SO-8FL

NTMFS0D5N03CT1G 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel, SO8-FL  
30 V, 0.52 mW, 464 A  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
0.52 mW @ 10 V  
0.78 mW @ 4.5 V  
30 V  
464 A  
NTMFS0D5N03C  
D (58)  
Features  
Advanced Package (5x6mm) with Excellent Thermal Conduction  
Ultra Low R  
to Improve System Efficiency  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
DS(on)  
G (4)  
Compliant  
S (1,2,3)  
NCHANNEL MOSFET  
Applications  
ORing  
Motor Drive  
MARKING  
DIAGRAMS  
D
Power Load Switch  
DCDC Converters  
Battery Management and Protection  
S
D
D
DFN5 (SO8FL)  
CASE 506EZ  
0D5N3C  
AYWZZ  
S
S
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
G
1
Parameter  
DraintoSource Voltage  
Symbol  
Value  
30  
Unit  
V
D
V
DSS  
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceabililty  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
T
= 25°C  
=100°C  
= 25°C  
I
D
464  
328  
200  
A
C
q
JC  
Steady  
State  
(Note 2)  
C
Power Dissipation  
T
C
P
D
W
A
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
R
(Note 2)  
q
JC  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
65  
46  
q
JA  
T = 100°C  
A
Steady  
State  
(Notes 1, 2)  
Power Dissipation  
T = 25°C  
A
P
D
3.9  
W
R
(Notes 1, 2)  
q
JA  
Pulsed Drain Current T = 25°C, t = 10 ms  
I
DM  
900  
166  
467  
A
A
A
p
Source Current (Body Diode)  
I
S
Single Pulse DraintoSource Avalanche  
Energy (I = 96 A  
E
AS  
mJ  
)
pk  
L
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
°C  
J
STG  
+175  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. Surfacemounted on FR4 board using 1 in pad, 2 oz Cu pad.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
October, 2021 Rev. 4  
NTMFS0D5N03C/D  
 

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