NTMFS4122N
Power MOSFET
30 V, 23 A, Single N-Channel,
SO-8 Flat Lead
Features
•ꢀLow R
DS(on)
http://onsemi.com
•ꢀLow Inductance SO-8 Package
•ꢀThis is a Pb-Free Device
Applications
I
MAX
(Note 1)
D
V
R
DS(on)
TYP
(BR)DSS
•ꢀNotebooks, Graphics Cards
•ꢀDC-DC Converters
•ꢀSynchronous Rectification
4.6 mW @ 10 V
6.3 mW @ 4.5 V
30 V
23 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
D
Parameter
Drain-to-Source Voltage
Symbol Value Unit
V
30
$20
14
V
V
A
DSS
Gate-to-Source Voltage
V
GS
G
Continuous Drain Current
(Note 1 )
T = 25°C
I
D
A
Steady
State
T = 85°C
A
10
S
t v10 s T = 25°C
23
A
Power Dissipation (Note 1) Steady
State
P
2.2
W
A
D
MARKING
DIAGRAM
T = 25°C
A
t v10 s
5.8
9.1
6.5
0.9
68
D
Continuous Drain Current
(Note 2)
T = 25°C
I
D
A
S
S
D
D
Steady
State
T = 85°C
A
1
4122N
AYWWG
G
SO-8 FLAT LEAD
CASE 488AA
STYLE 1
Power Dissipation (Note 2)
Pulsed Drain Current
T = 25°C
A
P
D
W
A
S
G
t = 10 ms
p
I
DM
D
Operating Junction and Storage Temperature
T , T
J
-55 to
150
°C
stg
4122N = Specific Device Code
A
= Assembly Location
= Year
= Work Week
Source Current (Body Diode)
I
7.0
A
S
Y
Single Pulse Drain-to-Source Avalanche Energy
(V = 30 V, V = 10 V, I = 21 A, L = 1 mH,
E
AS
220
mJ
WW
G
DD
GS
PK
= Pb-Free Package
R
G
= 25 W)
(Note: Microdot may be in either location)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
ORDERING INFORMATION
THERMAL RESISTANCE MAXIMUM RATINGS
†
Device
Package
Shipping
Parameter
Symbol Value Unit
NTMFS4122NT1G SO-8 FL 1500 Tape & Reel
(Pb-Free)
Junction-to-Ambient - Steady State (Note 1)
Junction-to-Ambient - t v10 s (Note 1)
Junction-to-Ambient - Steady State (Note 2)
R
R
R
56.3
21.5
°C/W
q
JA
q
JA
q
JA
NTMFS4122NT3G SO-8 FL 5000 Tape & Reel
(Pb-Free)
141.6
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.0264 in sq).
*For additional information on our Pb-Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
©ꢀ Semiconductor Components Industries, LLC, 2007
July, 2007 - Rev. 4
1
Publication Order Number:
NTMFS4122N/D