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NTMFS4709N PDF预览

NTMFS4709N

更新时间: 2024-09-25 06:00:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 86K
描述
Power MOSFET 30 V, 94 A, Single N-Channel, SOIC-8 FL

NTMFS4709N 数据手册

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NTMFS4709N  
Power MOSFET  
30 V, 94 A, Single N-Channel, SOIC-8 FL  
Features  
ꢀLow R  
to Minimize Conduction Losses  
DS(on)  
http://onsemi.com  
ꢀLow Capacitance to Minimize Driver Losses  
ꢀOptimized Gate Charge to Minimize Switching Losses  
ꢀThese are Pb-Free Devices  
V
R
DS(on)  
Typ  
I Max  
D
(BR)DSS  
2.85 mW @ 10 V  
4.0 mW @ 4.5 V  
Applications  
30 V  
94 A  
ꢀVCORE Applications  
ꢀDC-DC Converters  
ꢀLow Side Switching  
N-Channel  
D
MAXIMUM RATINGS (T =25°C unless otherwise stated)  
J
Rating  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
Continuous Drain  
Symbol  
Value  
30  
Unit  
V
V
DSS  
V
GS  
20  
V
G
T = 25°C  
I
D
18  
A
A
Current R  
(Note 1)  
q
JA  
S
T = 85°C  
A
13  
Power Dissipation  
(Note 1)  
T = 25°C  
P
2.35  
W
A
A
D
D
D
R
q
JA  
MARKING DIAGRAM &  
PIN ASSIGNMENT  
Continuous Drain  
Current R  
(Note 2)  
T = 25°C  
A
I
D
11  
8.0  
q
JA  
D
T = 85°C  
A
Steady  
State  
S
S
S
G
D
D
1
4709N  
AYWWG  
G
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
I
0.91  
W
A
SOIC-8 FLAT LEAD  
CASE 488AA  
STYLE 1  
R
q
JA  
Continuous Drain  
Current R  
(Note 1)  
T
T
T
= 25°C  
= 85°C  
= 25°C  
94  
68  
C
C
C
D
D
q
JC  
4709N = Specific Device Code  
Power Dissipation  
(Note 1)  
P
62.5  
W
A
A
= Assembly Location  
= Year  
= Work Week  
R
q
JC  
Y
WW  
Pulsed Drain Cur‐  
rent  
T = 25°C,  
A
t = 10 ms  
I
140  
140  
DM  
G = Pb-Free Package  
(Note: Microdot may be in either location)  
p
Current limited by  
package  
T = 25°C  
I
A
A
DmaxPkg  
ORDERING INFORMATION  
Operating Junction and  
Storage Temperature  
T ,  
J
-55 to  
+150  
°C  
T
STG  
Device  
Package  
Shipping  
Source Current (Body Diode)  
Drain to Source  
I
62.5  
10  
A
S
NTMFS4709NT1G SOIC-8 FL 1500ꢀ/aTpe & Reel  
(Pb-Free)  
dV/dt  
V/ns  
mJ  
Single Pulse Drain-to-Source Avalanche  
Energy T = 25°C, V = 50 V, V = 10 V,  
E
AS  
450  
NTMFS4709NT3G SOIC-8 FL 5000ꢀ/aTpe & Reel  
(Pb-Free)  
J
DD  
GS  
I = 30 A , L = 1.0 mH, R = 25 W  
L
pk  
G
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
260  
°C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface-mounted on FR4 board using 1 sq-in pad, 1 oz Cu.  
2. Surface-mounted on FR4 board using the minimum recommended pad size.  
©ꢀ Semiconductor Components Industries, LLC, 2007  
July, 2007 - Rev. 3  
1
Publication Order Number:  
NTMFS4709N/D  
 

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