NTMFS4709N
Power MOSFET
30 V, 94 A, Single N-Channel, SOIC-8 FL
Features
•ꢀLow R
to Minimize Conduction Losses
DS(on)
http://onsemi.com
•ꢀLow Capacitance to Minimize Driver Losses
•ꢀOptimized Gate Charge to Minimize Switching Losses
•ꢀThese are Pb-Free Devices
V
R
DS(on)
Typ
I Max
D
(BR)DSS
2.85 mW @ 10 V
4.0 mW @ 4.5 V
Applications
30 V
94 A
•ꢀVCORE Applications
•ꢀDC-DC Converters
•ꢀLow Side Switching
N-Channel
D
MAXIMUM RATINGS (T =25°C unless otherwise stated)
J
Rating
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain
Symbol
Value
30
Unit
V
V
DSS
V
GS
20
V
G
T = 25°C
I
D
18
A
A
Current R
(Note 1)
q
JA
S
T = 85°C
A
13
Power Dissipation
(Note 1)
T = 25°C
P
2.35
W
A
A
D
D
D
R
q
JA
MARKING DIAGRAM &
PIN ASSIGNMENT
Continuous Drain
Current R
(Note 2)
T = 25°C
A
I
D
11
8.0
q
JA
D
T = 85°C
A
Steady
State
S
S
S
G
D
D
1
4709N
AYWWꢀG
G
Power Dissipation
(Note 2)
T = 25°C
A
P
I
0.91
W
A
SOIC-8 FLAT LEAD
CASE 488AA
STYLE 1
R
q
JA
Continuous Drain
Current R
(Note 1)
T
T
T
= 25°C
= 85°C
= 25°C
94
68
C
C
C
D
D
q
JC
4709N = Specific Device Code
Power Dissipation
(Note 1)
P
62.5
W
A
A
= Assembly Location
= Year
= Work Week
R
q
JC
Y
WW
Pulsed Drain Cur‐
rent
T = 25°C,
A
t = 10 ms
I
140
140
DM
G = Pb-Free Package
(Note: Microdot may be in either location)
p
Current limited by
package
T = 25°C
I
A
A
DmaxPkg
ORDERING INFORMATION
Operating Junction and
Storage Temperature
T ,
J
-55 to
+150
°C
T
STG
†
Device
Package
Shipping
Source Current (Body Diode)
Drain to Source
I
62.5
10
A
S
NTMFS4709NT1G SOIC-8 FL 1500ꢀ/ꢀaTpe & Reel
(Pb-Free)
dV/dt
V/ns
mJ
Single Pulse Drain-to-Source Avalanche
Energy T = 25°C, V = 50 V, V = 10 V,
E
AS
450
NTMFS4709NT3G SOIC-8 FL 5000ꢀ/ꢀaTpe & Reel
(Pb-Free)
J
DD
GS
I = 30 A , L = 1.0 mH, R = 25 W
L
pk
G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
260
°C
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface-mounted on FR4 board using 1 sq-in pad, 1 oz Cu.
2. Surface-mounted on FR4 board using the minimum recommended pad size.
©ꢀ Semiconductor Components Industries, LLC, 2007
July, 2007 - Rev. 3
1
Publication Order Number:
NTMFS4709N/D