NTMFS4833NS
SENSEFET) Power MOSFET
30 V, 156 A, Single N−Channel, SO−8 FL
Features
• Accurate, Lossless Current Sensing
• Low R
to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
DS(on)
http://onsemi.com
• Optimized Gate Charge to Minimize Switching Losses
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
2.2 mW @ 10 V
3.4 mW @ 4.5 V
156 A
127 A
30 V
Applications
• CPU Power Delivery
• DC−DC Converters
• Low Side Switching
DRAIN
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
GATE
Kelvin
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
Value
30
Unit
V
V
DSS
SENSE SOURCE
V
GS
20
V
MARKING
DIAGRAM
Continuous Drain
Current R
I
D
A
T = 25°C
26
A
q
JA
T = 85°C
A
18
(Note 1)
(Do Not Connect)
NC
D
S
1
Power Dissipation
T = 25°C
P
2.31
W
A
A
D
D
D
4833NS
S
SENSE
KELVIN
K1
R
(Note 1)
q
JA
SO−8 FLAT LEAD
CASE 506BQ
AYWZZ
S
G
Continuous Drain
Current R
I
D
T = 25°C
A
16
11.6
0.9
q
JA
(Do Not Connect)
D
T = 85°C
A
Steady
State
(Note 2)
Power Dissipation
T = 25°C
A
P
I
W
A
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
R
(Note 2)
q
JA
Continuous Drain
Current R
T
C
T
C
T
C
= 25°C
= 85°C
= 25°C
156
113
D
q
JC
(Note 1)
Power Dissipation
P
86.2
W
A
ORDERING INFORMATION
R
(Note 1)
q
JC
Pulsed Drain
Current
T = 25°C,
t = 10 ms
I
312
†
A
p
DM
Device
Package
Shipping
NTMFS4833NST1G SO−8 FL 1500 Tape / Reel
(Pb−Free)
Operating Junction and Storage
Temperature
T , T
−55 to
+150
°C
J
STG
Source Current (Body Diode)
Drain to Source DV/DT
I
86
6
A
NTMFS4833NST3G SO−8 FL 5000 Tape / Reel
(Pb−Free)
S
dV/dt
EAS
V/ns
mJ
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Single Pulse Drain−to−Source Avalanche
612.5
Energy (T = 25°C, V = 30 V, V = 10 V,
J
DD
GS
I = 35 A , L = 1.0 mH, R = 25 W)
L
pk
G
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
260
°C
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
May, 2012 − Rev. 1
NTMFS4833NS/D