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NTMFS4833NS PDF预览

NTMFS4833NS

更新时间: 2024-09-25 01:14:15
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 149K
描述
Single N−Channel Power MOSFET

NTMFS4833NS 数据手册

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NTMFS4833NS  
SENSEFET) Power MOSFET  
30 V, 156 A, Single NChannel, SO8 FL  
Features  
Accurate, Lossless Current Sensing  
Low R  
to Minimize Conduction Losses  
Low Capacitance to Minimize Driver Losses  
DS(on)  
http://onsemi.com  
Optimized Gate Charge to Minimize Switching Losses  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
2.2 mW @ 10 V  
3.4 mW @ 4.5 V  
156 A  
127 A  
30 V  
Applications  
CPU Power Delivery  
DCDC Converters  
Low Side Switching  
DRAIN  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
GATE  
Kelvin  
Parameter  
DraintoSource Voltage  
GatetoSource Voltage  
Symbol  
Value  
30  
Unit  
V
V
DSS  
SENSE SOURCE  
V
GS  
20  
V
MARKING  
DIAGRAM  
Continuous Drain  
Current R  
I
D
A
T = 25°C  
26  
A
q
JA  
T = 85°C  
A
18  
(Note 1)  
(Do Not Connect)  
NC  
D
S
1
Power Dissipation  
T = 25°C  
P
2.31  
W
A
A
D
D
D
4833NS  
S
SENSE  
KELVIN  
K1  
R
(Note 1)  
q
JA  
SO8 FLAT LEAD  
CASE 506BQ  
AYWZZ  
S
G
Continuous Drain  
Current R  
I
D
T = 25°C  
A
16  
11.6  
0.9  
q
JA  
(Do Not Connect)  
D
T = 85°C  
A
Steady  
State  
(Note 2)  
Power Dissipation  
T = 25°C  
A
P
I
W
A
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceability  
R
(Note 2)  
q
JA  
Continuous Drain  
Current R  
T
C
T
C
T
C
= 25°C  
= 85°C  
= 25°C  
156  
113  
D
q
JC  
(Note 1)  
Power Dissipation  
P
86.2  
W
A
ORDERING INFORMATION  
R
(Note 1)  
q
JC  
Pulsed Drain  
Current  
T = 25°C,  
t = 10 ms  
I
312  
A
p
DM  
Device  
Package  
Shipping  
NTMFS4833NST1G SO8 FL 1500 Tape / Reel  
(PbFree)  
Operating Junction and Storage  
Temperature  
T , T  
55 to  
+150  
°C  
J
STG  
Source Current (Body Diode)  
Drain to Source DV/DT  
I
86  
6
A
NTMFS4833NST3G SO8 FL 5000 Tape / Reel  
(PbFree)  
S
dV/dt  
EAS  
V/ns  
mJ  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Single Pulse DraintoSource Avalanche  
612.5  
Energy (T = 25°C, V = 30 V, V = 10 V,  
J
DD  
GS  
I = 35 A , L = 1.0 mH, R = 25 W)  
L
pk  
G
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
260  
°C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.  
2. Surfacemounted on FR4 board using the minimum recommended pad size.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
May, 2012 Rev. 1  
NTMFS4833NS/D  
 

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