NTMFS4744N
Power MOSFET
30 V, 53 A, Single N-Channel, SO-8 FL
Features
•ꢀLow RDS(on) to Minimize Conduction Losses
•ꢀLow Capacitance to Minimize Driver Losses
•ꢀOptimized Gate Charge to Minimize Switching Losses
•ꢀThese are Pb-Free Devices
http://onsemi.com
V
R
DS(on)
MAX
I MAX
D
(BR)DSS
Applications
10 mW @ 10 V
14 mW @ 4.5 V
•ꢀCPU Power Delivery
•ꢀDC-DC Converters
•ꢀLow Side Switching
30 V
53 A
N-Channel
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain
Symbol
Value
30
Unit
V
V
DSS
V
GS
20
V
G
T = 25°C
11
I
D
A
A
Current R
(Note 1)
q
JA
T = 85°C
A
8.0
2.2
S
Power Dissipation
(Note 1)
T = 25°C
A
P
D
W
A
R
q
JA
T = 25°C
A
7.0
5.0
Continuous Drain
Current R
(Note 2)
ID
MARKING
DIAGRAM
q
JA
T = 85°C
A
Steady
State
D
Power Dissipation
(Note 2)
T = 25°C
A
P
I
0.88
W
A
D
R
q
JA
S
S
S
G
D
D
1
4744N
AYWWG
G
T
T
T
= 25°C
= 85°C
= 25°C
53
38
Continuous Drain
Current R
C
C
C
D
SO-8 FLAT LEAD
CASE 488AA
STYLE 1
q
JC
(Note 1)
Power Dissipation
(Note 1)
D
P
D
47.2
W
A
R
q
JC
4744N = Specific Device Code
Pulsed Drain
Current
t =10ms
p
T = 25°C
A
I
DM
106
A
= Assembly Location
= Year
= Work Week
Y
Operating Junction and Storage Temperature
T , T
J
-55 to
+150
°C
STG
WW
G
= Pb-Free Package
Source Current (Body Diode)
Drain to Source dV/dt
I
S
46
6.0
286
A
(Note: Microdot may be in either location)
dV/dt
EAS
V/ns
mJ
Single Pulse Drain-to-Source Avalanche
Energy (V = 50 V, V = 10 V,
DD GS
I = 24 A , L = 1.0 mH, R = 25 W)
ORDERING INFORMATION
L
pk
G
†
Device
Package
Shipping
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
260
°C
L
NTMFS4744NT1G SO-8 FL 1500 Tape & Reel
(Pb-Free)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
NTMFS4744NT3G SO-8 FL 5000 Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©ꢀ Semiconductor Components Industries, LLC, 2007
July, 2007 - Rev. 4
1
Publication Order Number:
NTMFS4744N/D