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NTMFS0D5N04XLT1G PDF预览

NTMFS0D5N04XLT1G

更新时间: 2024-09-25 11:13:23
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 205K
描述
Power MOSFET, Single, N-Channel, 40V, 0.49mΩ, 455A, SO8-FL 5x6

NTMFS0D5N04XLT1G 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel, Logic Level,  
SO-8FL  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
0.49 mW @ 10 V  
0.78 mW @ 4.5 V  
40 V  
455 A  
40 V, 0.49 mW, 455 A  
D (58)  
NTMFS0D5N04XL  
Features  
Low R  
G (4)  
to Minimize Conduction Loss  
DS(on)  
Low Q with Soft Recovery to Minimize E Loss and Voltage  
RR  
RR  
S (1,2,3)  
NCHANNEL MOSFET  
Spike  
Low Q and Capacitance to Minimize Driving and Switching Loss  
G
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
MARKING  
DIAGRAM  
D
Typical Applications  
High Switching Frequency DCDC Conversion  
Synchronous Rectification  
S
S
S
D
D
DFNW5 (SO8FL)  
CASE 506FA  
0D5N4L  
AYWZZ  
G
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
1
C
D
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
0D5N4L = Specific Device Code  
A
Y
W
ZZ  
= Assembly Location  
= Year  
= Work Week  
= Lot Traceabililty  
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
T
= 25°C  
= 100°C  
= 25°C  
I
455  
322  
194  
97.3  
2474  
2474  
A
C
D
Steady  
Current R  
(Note 2)  
q
JC  
State  
T
C
Power Dissipation  
(Note 2)  
T
C
P
W
A
D
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Steady  
State  
R
q
JC  
T
C
= 100°C  
Pulsed Drain Current  
I
DM  
T = 25°C, t = 100 ms  
A
p
Pulsed Sourced  
Current (Body Diode)  
I
SM  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
STG  
Source Current (Body Diode)  
I
S
306  
A
Single Pulse DraintoSource Avalanche  
E
AS  
1325  
mJ  
Energy (I  
= 94 A)  
Lpk  
Lead Temperature Soldering Reflow for  
Soldering Purposes (1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. Surfacemounted on FR4 board using 1 in pad size, 1 oz Cu pad.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
3. R  
Thermal Resistance Junction to Case Top = 20 °C/W.  
q
JCT  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
June, 2023 Rev. 3  
NTMFS0D5N04XL/D  
 

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