NTMFS4120N
Power MOSFET
30 V, 31 A, Single N-Channel,
SO-8 Flat Lead
Features
•ꢀLow R
DS(on)
http://onsemi.com
•ꢀOptimized Gate Charge
•ꢀLow Inductance SO-8 Package
•ꢀThese are Pb-Free Devices
Applications
I
Max
(Note 1)
D
V
R
DS(on)
Typ
(BR)DSS
3.5 mW @ 10 V
4.2 mW @ 4.5 V
30 V
31 A
•ꢀNotebooks, Graphics Cards
•ꢀDC-DC Converters
•ꢀSynchronous Rectification
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain-to-Source Voltage
Symbol Value Unit
V
30
$20
18
V
V
A
DSS
G
Gate-to-Source Voltage
V
GS
Continuous Drain Current
(Note 1 )
T = 25°C
I
D
A
Steady
State
S
T = 85°C
A
13
t v10 s T = 25°C
31
A
Power Dissipation (Note 1) Steady
State
P
2.2
W
A
MARKING
DIAGRAM
D
T = 25°C
A
t v10 s
6.9
11
D
Continuous Drain Current
(Note 2)
T = 25°C
I
D
S
S
D
D
A
Steady
State
4120N
AYWWG
G
1
T = 85°C
A
8.0
0.9
94
SO-8 FLAT LEAD
CASE 488AA
STYLE 1
S
Power Dissipation (Note 2)
Pulsed Drain Current
T = 25°C
A
P
D
W
A
G
t = 10 ms
p
I
DM
D
Operating Junction and Storage Temperature
T , T
J
-55 to
150
°C
stg
4120N = Specific Device Code
A
= Assembly Location
= Year
= Work Week
Source Current (Body Diode)
I
7.0
A
S
Y
Single Pulse Drain-to-Source Avalanche Energy
(V = 30 V, V = 10 V, I = 30 A,
E
AS
450
mJ
WW
G
DD GS
L = 1 mH, R = 25 W)
PK
= Pb-Free Package
G
(Note: Microdot may be in either location)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
ORDERING INFORMATION
THERMAL RESISTANCE MAXIMUM RATINGS
†
Device
Package
Shipping
Parameter
Symbol Value Unit
Junction-to-Case - Steady State
R
q
JC
R
q
JA
R
q
JA
R
q
JA
1.7
55.8
18
°C/W
NTMFS4120NT1G SO-8 FL 1500 Tape & Reel
(Pb-Free)
Junction-to-Ambient - Steady State (Note 1)
Junction-to-Ambient - t v10 s (Note 1)
Junction-to-Ambient - Steady State (Note 2)
NTMFS4120NT3G SO-8 FL 5000 Tape & Reel
(Pb-Free)
139.1
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size
(Cu area = 1.0 in sq).
©ꢀ Semiconductor Components Industries, LLC, 2007
July, 2007 - Rev. 3
1
Publication Order Number:
NTMFS4120N/D