MOSFET - Power, Single
N-Channel
120 V, 6.0 mW, 93 A
NTMFS006N12MC
Features
www.onsemi.com
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• Soft Body Diode Reduces Voltage Ringing
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
6.0 mW @ 10 V
13 mW @ 6.0 V
120 V
93 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
120
20
Unit
V
D (5)
V
DSS
Gate−to−Source Voltage
V
GS
V
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
93
A
C
D
G (4)
q
JC
T
C
58
(Notes 1, 3)
Steady
State
Power Dissipation
T
C
P
104
41
W
A
D
S (1,2,3)
N−CHANNEL MOSFET
R
(Note 1)
q
JC
T
C
= 100°C
Continuous Drain
Current R
T = 25°C
A
I
D
15
q
JA
T = 100°C
A
9
(Notes 1, 2, 3)
Steady
State
MARKING
DIAGRAM
Power Dissipation
T = 25°C
A
P
2.7
1.1
522
W
D
R
(Notes 1, 2)
q
JA
D
T = 100°C
A
1
S
S
S
G
D
D
Pulsed Drain Current
T = 25°C, t = 100 ms
I
DM
A
A
p
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
06N12C
AYWZZ
Operating Junction and Storage Temperature
Range
T , T
−55 to
+ 150
°C
J
stg
D
Source Current (Body Diode)
I
86
A
S
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
Single Pulse Drain−to−Source Avalanche
E
120
mJ
AS
Energy (I
= 49A)
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
1.2
Unit
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
45
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2020
1
Publication Order Number:
October, 2020 − Rev. 0
NTMFS006N12MC/D