NTMFD5C466N
Power MOSFET
40 V, 8.1 mW, 49 A, Dual N−Channel
Features
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
• Low Q and Capacitance to Minimize Driver Losses
DS(on)
www.onsemi.com
G
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
40 V
8.1 mꢂ @ 10 V
49 A
V
DSS
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
T
= 25°C
I
49
A
C
D
Dual N−Channel
ꢀ
JC
T
C
= 100°C
35
(Notes 1, 2, 3)
Steady
State
D1
D2
Power Dissipation
T
C
= 25°C
P
38
19
14
W
A
D
R
(Notes 1, 2)
ꢀ
JC
T
C
= 100°C
Continuous Drain
Current R
T = 25°C
A
I
D
G1
G2
ꢀ
JA
T = 100°C
A
10
(Notes 1, 2, 3)
Steady
State
Power Dissipation
T = 25°C
A
P
3.0
1.5
169
W
S1
S2
D
R
(Notes 1 & 2)
ꢀ
JA
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ꢁ s
I
DM
A
A
p
MARKING
DIAGRAM
Operating Junction and Storage Temperature
T , T
−55 to
°C
J
stg
+ 175
D1 D1
Source Current (Body Diode)
I
S
31
72
A
S1
G1
S2
G2
D1
1
D1
D2
D2
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
5C466N
AYWZZ
DFN8 5x6
(SO8FL)
CASE 506BT
Energy (T = 25°C, I
= 3 A)
J
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
D2 D2
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
5C466N = Specific Device Code
A
= Assembly Location
= Year
Y
W
ZZ
= Work Week
= Lot Traceability
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Junction−to−Case − Steady State
R
4
°C/W
ꢀ
JC
Junction−to−Ambient − Steady State (Note 2)
R
49
ꢀ
JA
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
2
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
October, 2018 − Rev. 0
NTMFD5C466N/D