DATA SHEET
www.onsemi.com
MOSFET - Power, Dual,
N-Channel, Power Clip,
POWERTRENCH),
Asymmetric
FET
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
3.0 mꢂ @ 10 V
3.75 mꢂ @ 4.5 V
0.87 mꢂ @ 10 V
1.1 mꢂ @ 4.5 V
Q1
25 V
75 A
Q2
25 V
178 A
25 V
PIN1
NTMFD1D1N02X
Features
• Small Footprint (5x6mm) for Compact Design
• Low R
to Minimize Conduction Losses
• Low Q and Capacitance to Minimize Driver Losses
DS(on)
G
PQFN8
POWER CLIP
CASE 483AR
• These are Pb−free, Halogen Free / BFR Free and are RoHS
Compliant
Typical Applications
• DC−DC Converters
• System Voltage Rails
MARKING DIAGRAM
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
NTMFD1
D1N02X
AWLYWW
Sym-
bol
Parameter
Drain−to−Source Voltage
Q1
Q2
Unit
V
V
DSS
25
25
NTMFD1D1N02X = Specific Device Code
A
WL
Y
= Assembly Site
Gate−to−Source Voltage
V
+16V +16V
V
GS
−12V −12V
= Wafer Lot Number
= Year of Production
= Work Week Number
Continuous Drain Cur- Steady
T
T
T
= 25°C
= 85°C
= 25°C
I
75
54
27
178
128
44
A
C
C
C
D
WW
rent R
(Note 3)
State
ꢀ
JC
Power Dissipation
(Note 3)
P
W
A
D
D
D
ELECTRICAL CONNECTION
R
ꢀ
JC
Continuous Drain Cur- Steady
rent R (Notes 1, 3) State
T = 25°C
A
I
20
15
40
29
D
ꢀ
JA
T = 85°C
A
Power Dissipation
(Notes 1, 3)
T = 25°C
A
P
2.1
2.3
W
A
R
ꢀ
JA
Continuous Drain Cur- Steady
rent R (Notes 2, 3) State
T = 25°C
A
I
14
10
27
20
D
ꢀ
JA
T = 85°C
A
Power Dissipation
(Notes 2, 3)
T = 25°C
A
P
0.96
1.0
W
A
R
ꢀ
JA
ORDERING INFORMATION
Pulsed Drain Current
T
p
= 25°C,
t = 100 ꢁ s
I
331
47
625
277
C
DM
†
Device
Package
Shipping
NTMFD1D1N02X
PQFN8
(Pb−Free)
3000 / Tape &
Reel
Single Pulse Drain−to−Source Avalanche
Energy Q1: I = 5.6 A , L = 3 mH (Note 4)
E
mJ
AS
L
pk
Energy Q2: I = 13.6 A , L = 3 mH (Note 4)
L
pk
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Operating Junction and Storage Temperature
Range
T ,
−55 to 150
°C
°C
J
T
stg
Lead Temperature Soldering Reflow for
Soldering Purposes (1/8″ from case for 10 s)
T
260
L
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
© Semiconductor Components Industries, LLC, 2021
1
Publication Order Number:
July, 2022 − Rev. 0
NTMFD1D1N02X/D