NTMD6N02R2
Power MOSFET
6.0 Amps, 20 Volts
N−Channel Enhancement Mode
Dual SO−8 Package
http://onsemi.com
Features
V
R
TYP
I MAX
D
DSS
DS(ON)
• Ultra Low R
DS(on)
20 V
35 mW @ V = 4.5 V
6.0 A
GS
• Higher Efficiency Extending Battery Life
• Logic Level Gate Drive
• Miniature Dual SOIC−8 Surface Mount Package
• Diode Exhibits High Speed, Soft Recovery
• Avalanche Energy Specified
• SOIC−8 Mounting Information Provided
• Pb−Free Package is Available
N−Channel
D
G
Applications
S
• DC−DC Converters
• Low Voltage Motor Control
• Power Management in Portable and Battery−Powered Products,
for example, Computers, Printers, Cellular and Cordless Telephones
and PCMCIA Cards
SOIC−8
CASE 751
STYLE 11
8
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Symbol
Value
20
Unit
V
MARKING DIAGRAM
& PIN ASSIGNMENT
Drain−to−Source Voltage
V
DSS
DGR
Drain−to−Gate Voltage (R = 1.0 MW)
V
20
V
GS
1
2
3
4
8
7
6
5
Source 1
Gate 1
Drain 1
Drain 1
Drain 2
Drain 2
Gate−to−Source Voltage − Continuous
V
"12
V
GS
Thermal Resistance,
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T = 25°C
Continuous Drain Current @ T = 25°C
Continuous Drain Current @ T = 70°C
Pulsed Drain Current (Note 4)
R
q
JA
62.5
2.0
6.5
5.5
50
°C/W
W
A
A
A
Source 2
Gate 2
P
D
A
I
A
D
I
A
D
(Top View)
I
DM
Thermal Resistance,
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T = 25°C
Continuous Drain Current @ T = 25°C
Continuous Drain Current @ T = 70°C
Pulsed Drain Current (Note 4)
E6N02 = Specific Device Code
R
P
I
102
1.22
5.07
4.07
40
°C/W
W
A
A
A
q
JA
A
Y
= Assembly Location
= Year
A
D
A
D
WW
G
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
I
A
D
I
DM
Thermal Resistance
Junction−to−Ambient (Note 3)
R
P
I
172
0.73
3.92
3.14
30
°C/W
W
A
A
A
ORDERING INFORMATION
q
JA
Total Power Dissipation @ T = 25°C
A
D
†
Device
Package
Shipping
Continuous Drain Current @ T = 25°C
Continuous Drain Current @ T = 70°C
Pulsed Drain Current (Note 4)
A
D
I
A
D
NTMD6N02R2
SOIC−8
2500/Tape & Reel
2500/Tape & Reel
I
DM
NTMD6N02R2G
SOIC−8
1. Mounted onto a 2 in square FR−4 Board
(1 in sq. 2 oz. Cu 0.06 in thick single sided), t < 10 seconds.
2. Mounted onto a 2 in square FR−4 Board
(1 in sq. 2 oz. Cu 0.06 in thick single sided), t = steady state.
3. Minimum FR−4 or G−10 PCB, t = steady state.
4. Pulse Test: Pulse Width = 10 ms, Duty Cycle = 2%.
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
August, 2005 − Rev. 3
NTMD6N02R2/D