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NTMD6N02R2/D PDF预览

NTMD6N02R2/D

更新时间: 2024-11-23 23:55:07
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描述
Power MOSFET 6.0 Amps, 20 Volts

NTMD6N02R2/D 数据手册

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NTMD6N02R2  
Product Preview  
Power MOSFET  
6.0 Amps, 20 Volts  
N–Channel Enhancement Mode  
Dual SO–8 Package  
Features  
http://onsemi.com  
Ultra Low R  
DS(on)  
6.0 AMPERES  
20 VOLTS  
35 mW @ VGS = 4.5 V  
Higher Efficiency Extending Battery Life  
Logic Level Gate Drive  
Miniature Dual SO–8 Surface Mount Package  
Diode Exhibits High Speed, Soft Recovery  
Avalanche Energy Specified  
SO–8 Mounting Information Provided  
N–Channel  
Applications  
DC–DC Converters  
D
Low Voltage Motor Control  
Power Management in Portable and Battery–Powered Products, i.e.:  
Computers, Printers, Cellular and Cordless Telephones and PCMCIA  
Cards  
G
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
S
J
Rating  
Symbol  
Value  
20  
Unit  
V
Drain–to–Source Voltage  
V
V
DSS  
Drain–to–Gate Voltage (R = 1.0 MW)  
20  
V
8
GS  
DGR  
Gate–to–Source Voltage – Continuous  
V
"12  
V
GS  
1
Thermal Resistance –  
Junction–to–Ambient (Note 1.)  
SO–8  
CASE 751  
STYLE 11  
R
62.5  
2.0  
6.5  
5.5  
20  
°C/W  
W
A
A
A
θ
JA  
Total Power Dissipation @ T = 25°C  
P
I
I
A
D
Continuous Drain Current @ T = 25°C  
A
D
Continuous Drain Current @ T = 70°C  
A
D
Pulsed Drain Current (Note 4.)  
I
DM  
MARKING DIAGRAM  
& PIN ASSIGNMENT  
Thermal Resistance –  
Junction–to–Ambient (Note 2.)  
R
P
I
I
102  
1.22  
5.07  
4.07  
16  
°C/W  
W
A
A
A
θ
JA  
1
2
3
4
8
7
6
5
Total Power Dissipation @ T = 25°C  
Source 1  
Gate 1  
Drain 1  
Drain 1  
Drain 2  
Drain 2  
A
D
Continuous Drain Current @ T = 25°C  
A
D
E6N02  
LYWW  
Continuous Drain Current @ T = 70°C  
A
D
Source 2  
Gate 2  
Pulsed Drain Current (Note 4.)  
I
DM  
Thermal Resistance –  
Junction–to–Ambient (Note 3.)  
R
P
I
I
172  
0.73  
3.92  
3.14  
12  
°C/W  
W
A
A
A
θ
(Top View)  
JA  
Total Power Dissipation @ T = 25°C  
A
D
Continuous Drain Current @ T = 25°C  
A
D
E6N02 = Device Code  
Continuous Drain Current @ T = 70°C  
A
D
L
Y
= Assembly Location  
= Year  
Pulsed Drain Current (Note 4.)  
I
DM  
1. Mounted onto a 2square FR–4 Board (1sq. 2 oz. Cu 0.06thick single  
sided), t < 10 seconds.  
WW  
= Work Week  
2. Mounted onto a 2square FR–4 Board (1sq. 2 oz. Cu 0.06thick single  
sided), t = steady state.  
3. Minimum FR–4 or G–10 PCB, t = steady state.  
4. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%.  
ORDERING INFORMATION  
Device  
NTMD6N02R2  
Package  
Shipping  
2500/Tape & Reel  
This document contains information on a product under development. ON Semiconductor  
reserves the right to change or discontinue this product without notice.  
SO–8  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
November, 2000 – Rev. 0  
NTMD6N02R2/D  

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