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NTMD4N03R2G PDF预览

NTMD4N03R2G

更新时间: 2024-11-09 12:04:59
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
8页 126K
描述
Power MOSFET 4 A, 30 V, N−Channel SO−8 Dual

NTMD4N03R2G 技术参数

是否无铅:不含铅生命周期:Active
零件包装代码:SOT包装说明:SMALL OUTLINE, R-PDSO-G8
针数:8Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:1 week
风险等级:0.73Is Samacsys:N
雪崩能效等级(Eas):80 mJ配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):4 A
最大漏极电流 (ID):4 A最大漏源导通电阻:0.06 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G8
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:8
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):2 W
最大脉冲漏极电流 (IDM):12 A认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTMD4N03R2G 数据手册

 浏览型号NTMD4N03R2G的Datasheet PDF文件第2页浏览型号NTMD4N03R2G的Datasheet PDF文件第3页浏览型号NTMD4N03R2G的Datasheet PDF文件第4页浏览型号NTMD4N03R2G的Datasheet PDF文件第5页浏览型号NTMD4N03R2G的Datasheet PDF文件第6页浏览型号NTMD4N03R2G的Datasheet PDF文件第7页 
NTMD4N03, NVMD4N03  
Power MOSFET  
4 A, 30 V, NChannel SO8 Dual  
Features  
Designed for use in low voltage, high speed switching applications  
Ultra Low OnResistance Provides  
http://onsemi.com  
Higher Efficiency and Extends Battery Life  
R  
R  
= 0.048 W, V = 10 V (Typ)  
DS(on)  
DS(on)  
GS  
= 0.065 W, V = 4.5 V (Typ)  
GS  
V
R
Typ  
I Max  
D
DSS  
DS(ON)  
Miniature SO8 Surface Mount Package Saves Board Space  
Diode is Characterized for Use in Bridge Circuits  
Diode Exhibits High Speed, with Soft Recovery  
30 V  
48 mW @ V = 10 V  
4.0 A  
GS  
NVMD Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AECQ101  
Qualified and PPAP Capable*  
NChannel  
D
D
These Devices are PbFree and are RoHS Compliant  
Applications  
G
8
G
DCDC Converters  
Computers  
Printers  
Cellular and Cordless Phones  
Disk Drives and Tape Drives  
S
S
MARKING DIAGRAM*  
AND PIN ASSIGNMENT  
D1 D1 D2 D2  
8
1
SOIC8  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
SUFFIX NB  
CASE 751  
STYLE 11  
E4N03  
AYWW G  
G
Rating  
Symbol  
Value  
Unit  
DraintoSource Voltage  
GatetoSource Voltage Continuous  
Drain Current  
V
DSS  
30  
V
V
V
GS  
"20  
1
S1 G1 S2 G2  
Continuous @ T = 25°C  
Single Pulse (tp 10 ms)  
I
4.0  
12  
Adc  
Apk  
A
D
I
DM  
E4N03 = Specific Device Code  
Total Power Dissipation  
P
D
2.0  
W
°C  
mJ  
A
Y
WW  
G
= Assembly Location  
= Year  
= Work Week  
@ T = 25°C (Note 1)  
A
Operating and Storage  
Temperature Range  
T , T  
55 to  
+150  
J
stg  
= PbFree Package  
(Note: Microdot may be in either location)  
Single Pulse DraintoSource  
E
AS  
80  
*For additional marking information, refer to  
Application Note AND8002/D.  
Avalanche Energy Starting T = 25°C  
J
(V = 25 Vdc, V = 5.0 Vdc,  
DD  
GS  
Peak I = 4.45 Apk, L = 8 mH,  
L
R
G
= 25 W)  
ORDERING INFORMATION  
Thermal Resistance  
R
q
JA  
62.5  
260  
°C/W  
°C  
JunctiontoAmbient (Note 1)  
Device  
Package  
SOIC8  
(PbFree)  
Shipping  
2500 / Tape &  
Reel  
NTMD4N03R2G  
Maximum Lead Temperature for  
T
L
Soldering Purposes for 10 seconds  
NVMD4N03R2G*  
SOIC8  
(PbFree)  
2500 / Tape &  
Reel  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D  
1. When surface mounted to an FR4 board using 1pad size, t 10 s  
©
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
August, 2013 Rev. 4  
NTMD4N03R2/D  
 

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