NTJD3158C
Power MOSFET
20 V, +0.63/-0.82 A,
SC-88 Complementary, ESD Protected
Features
•ꢀComplementary N- and P-Channel MOSFET
•ꢀSmall Size Dual SC-88 Package
http://onsemi.com
•ꢀReduced Gate Charge to Improve Switching Response
•ꢀIndependently Connected Devices to Provide Design Flexibility
•ꢀThis is a Pb-Free Device
V
R
Max
I Max
D
(BR)DSS
DS(on)
375 mW @ 4.5 V
445 mW @ 2.5 V
300 mW @ -4.5 V
500 mW @ -2.5 V
N-Ch
20 V
0.63 A
Applications
P-Ch
-20 V
-0.82 A
•ꢀDC-DC Conversion Circuits
•ꢀLoad/Power Switching with Level Shift
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
SC-88 (SOT-363)
(6-Leads)
J
Parameter
Drain-to-Source Voltage
Symbol Value
Unit
V
V
DSS
20
12
S
1
2
3
6
5
D
1
1
1
2
Gate-to-Source Voltage
V
GS
V
N-Ch
N-Channel
Continuous Drain
Current (Note 1)
I
D
A
T = 25°C
0.63
0.46
0.72
-0.82
-0.59
-0.93
0.27
0.35
1.3
A
Steady State
T = 85°C
A
G
D
G
2
t ≤ 5 s
T = 25°C
A
P-Ch
P-Channel
Continuous Drain
Current (Note 1)
I
D
A
T = 25°C
A
Steady State
4
S
2
T = 85°C
A
t ≤ 5 s
Steady State
t ≤ 5 s
T = 25°C
A
(Top View)
Power Dissipation
(Note 1)
P
D
W
A
T = 25°C
A
MARKING DIAGRAM &
PIN ASSIGNMENT
Pulsed Drain
Current
I
DM
N-Ch
tp = 10 ms
D1 G2 S2
6
P-Ch
-1.6
1
Operating Junction and Storage Temperature
Source Current (Body Diode)
T , T
J
-55 to
150
°C
stg
TG MG
SC-88 (SOT-363)
CASE 419B
STYLE 26
G
I
S
0.46
260
A
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
°C
1
S1 G1 D2
TG
M
G
= Specific Device Code
= Date Code
= Pb-Free Package
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Max
460
357
226
Unit
°C/W
Junction-to-Ambient – Steady State (Note 1)
Junction-to-Ambient – t ≤ 5 s (Note 1)
Junction-to-Lead (Drain) – Steady State (Note 1)
R
R
q
q
JA
JA
(Note: Microdot may be in either location)
R
ORDERING INFORMATION
q
JL
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
Device
Package
Shipping†
NTJD3158CT1G
SC-88
(Pb-Free)
3000/Tape & Reel
(Cu area = 1.127 in sq [1 oz] including traces).
NTJD3158CT4G
SC-88
(Pb-Free)
10000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©ꢀ Semiconductor Components Industries, LLC, 2008
January, 2008 - Rev. 0
1
Publication Order Number:
NTJD3158C/D