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MRF182S PDF预览

MRF182S

更新时间: 2024-02-02 05:43:35
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体射频场效应晶体管放大器
页数 文件大小 规格书
8页 137K
描述
LATERAL N-CHANNEL BROADBAND RF POWER MOSFETs

MRF182S 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:CASE 360C-03, 2 PINReach Compliance Code:unknown
风险等级:5.66外壳连接:SOURCE
配置:SINGLE最小漏源击穿电压:65 V
FET 技术:METAL-OXIDE SEMICONDUCTOR最高频带:ULTRA HIGH FREQUENCY BAND
JESD-30 代码:R-CDFP-F2JESD-609代码:e0
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:FLATPACK峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

MRF182S 数据手册

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Order this document  
by MRF182/D  
SEMICONDUCTOR TECHNICAL DATA  
The RF MOSFET Line  
N–Channel Enhancement–Mode Lateral  
MOSFETs  
High Gain, Rugged Device  
Broadband Performance from HF to 1 GHz  
30 W, 1.0 GHz  
LATERAL N–CHANNEL  
BROADBAND  
Bottom Side Source Eliminates DC Isolators, Reducing Common  
Mode Inductances  
RF POWER MOSFETs  
D
CASE 360B–01, STYLE 1  
(MRF182)  
G
S
CASE 360C–03, STYLE 1  
(MRF182S)  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
V
GS  
±20  
Total Device Dissipation @ T = 70°C  
Derate above 70°C  
P
D
74  
0.57  
W
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
T
– 65 to +150  
200  
°C  
°C  
stg  
T
J
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
1.75  
°C/W  
θJC  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain–Source Breakdown Voltage  
(V = 0, I = 1.0 Adc)  
V
65  
1
1
Vdc  
µAdc  
µAdc  
(BR)DSS  
GS  
Zero Gate Voltage Drain Current  
(V = 28 V, V = 0)  
D
I
DSS  
DS  
Gate–Source Leakage Current  
(V = 20 V, V = 0)  
GS  
I
GSS  
GS  
DS  
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 5  
Motorola, Inc. 1997  

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