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MRF19030R3 PDF预览

MRF19030R3

更新时间: 2024-11-13 22:31:19
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摩托罗拉 - MOTOROLA 晶体射频场效应晶体管功率场效应晶体管放大器局域网
页数 文件大小 规格书
8页 390K
描述
RF POWER FIELD EFFECT TRANSISTORS

MRF19030R3 技术参数

生命周期:Transferred包装说明:NI-400, CASE 465E-04, 2 PIN
Reach Compliance Code:unknown风险等级:5.65
外壳连接:SOURCE配置:SINGLE
最小漏源击穿电压:65 VFET 技术:METAL-OXIDE SEMICONDUCTOR
最高频带:L BANDJESD-30 代码:R-CDFM-F2
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:200 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):83.3 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:FLAT端子位置:DUAL
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

MRF19030R3 数据手册

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ꢒ ꢓꢎ ꢓ ꢀꢓ ꢔꢕ  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MRF19030/D  
The RF MOSFET Line  
ꢀ ꢁ ꢂ ꢃꢄꢅ ꢆ ꢁꢇꢅ ꢈꢉ ꢊ ꢋꢋ ꢅ ꢌꢍ ꢎꢆ ꢏꢐ ꢑ ꢇꢑ ꢍꢃ ꢆ ꢑ  
N–Channel Enhancement–Mode Lateral MOSFETs  
Designed for class AB PCN and PCS base station applications with  
frequencies from 1.8 to 2.0 GHz. Suitable for FM, TDMA, CDMA and  
multicarrier amplifier applications.  
CDMA Performance @ 1990 MHz, 26 Volts  
IS–97 CDMA Pilot, Sync, Paging, Traffic Codes 8 Thru 13  
885 kHz — –47 dBc @ 30 kHz BW  
1.25 MHz — –55 dBc @ 12.5 kHz BW  
2.25 MHz — –55 dBc @ 1 MHz BW  
Output Power — 4.5 Watts Avg.  
2.0 GHz, 30 W, 26 V  
LATERAL N–CHANNEL  
RF POWER MOSFETs  
Power Gain — 13.5 dB  
Efficiency — 17%  
Internally Matched, Controlled Q, for Ease of Use  
High Gain, High Efficiency and High Linearity  
Integrated ESD Protection  
Designed for Maximum Gain and Insertion Phase Flatness  
CASE 465E–03, STYLE 1  
NI–400  
Capable of Handling 10:1 VSWR, @ 26 Vdc, 1.93 GHz, 30 Watts CW  
Output Power  
MRF19030R3  
Excellent Thermal Stability  
Characterized with Series Equivalent Large–Signal Impedance Parameters  
In Tape and Reel. R3 Suffix = 250 Units per 32 mm, 13 Inch Reel.  
CASE 465F–03, STYLE 1  
NI–400S  
MRF19030SR3  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
V
GS  
–0.5, +15  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
83.3  
0.48  
Watts  
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
T
–65 to +200  
200  
°C  
°C  
stg  
T
J
ESD PROTECTION CHARACTERISTICS  
Test Conditions  
Class  
Human Body Model  
Machine Model  
2 (Minimum)  
M3 (Minimum)  
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
2.1  
°C/W  
θ
JC  
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 7  
Motorola, Inc. 2002  

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