ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
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SEMICONDUCTOR TECHNICAL DATA
Order this document
by MRF185/D
The RF MOSFET Line
ꢀ ꢁ ꢂ ꢃꢄ ꢅ ꢆ ꢁꢇꢅ ꢈꢉ ꢊ ꢋ ꢌꢌ ꢅꢍ ꢎ ꢏꢆ ꢐꢑ ꢒ ꢇꢒ ꢎꢃ ꢆ
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N–Channel Enhancement–Mode Lateral MOSFET
• High Gain, Rugged Device
• Broadband Performance from HF to 1 GHz
1.0 GHz, 85 W, 28 V
LATERAL N–CHANNEL
BROADBAND
• Bottom Side Source Eliminates DC Isolators, Reducing Common Mode
Inductances
RF POWER MOSFET
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CASE 375B–04, STYLE 1
NI–860
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Vdc
Vdc
°C
Drain–Source Voltage
V
DSS
65
20
Gate–Source Voltage
V
GS
Storage Temperature Range
Operating Junction Temperature
T
stg
– 65 to +150
200
T
J
°C
Total Device Dissipation @ T = 25°C
Derate above 25°C
P
D
250
1.45
Watts
W/°C
C
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
Symbol
Max
Unit
R
0.7
°C/W
θ
JC
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
C
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
(V = 0 Vdc, I = 1 mAdc)
V
65
–
–
–
–
–
1
1
Vdc
µAdc
µAdc
(BR)DSS
GS
D
Zero Gate Voltage Drain Current
(V = 28 Vdc, V = 0 Vdc)
I
DSS
DS
GS
Gate–Source Leakage Current
(V = 20 Vdc, V = 0 Vdc)
I
–
GSS
GS
DS
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
REV 5
MOTOROLA RF DEVICE DATA
MRF185
1
Motorola, Inc. 2002
Archived 2005