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IXXH50N60B3D1 PDF预览

IXXH50N60B3D1

更新时间: 2024-11-18 21:11:59
品牌 Logo 应用领域
IXYS 局域网功率控制晶体管
页数 文件大小 规格书
7页 239K
描述
Insulated Gate Bipolar Transistor, 120A I(C), 600V V(BR)CES, N-Channel, TO-247AD, TO-247AD, 3 PIN

IXXH50N60B3D1 技术参数

生命周期:Transferred零件包装代码:TO-247AD
包装说明:TO-247AD, 3 PIN针数:3
Reach Compliance Code:unknown风险等级:5.06
外壳连接:COLLECTOR最大集电极电流 (IC):120 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
门极发射器阈值电压最大值:5.5 V门极-发射极最大电压:20 V
JEDEC-95代码:TO-247ADJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):600 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):320 ns
标称接通时间 (ton):75 nsBase Number Matches:1

IXXH50N60B3D1 数据手册

 浏览型号IXXH50N60B3D1的Datasheet PDF文件第2页浏览型号IXXH50N60B3D1的Datasheet PDF文件第3页浏览型号IXXH50N60B3D1的Datasheet PDF文件第4页浏览型号IXXH50N60B3D1的Datasheet PDF文件第5页浏览型号IXXH50N60B3D1的Datasheet PDF文件第6页浏览型号IXXH50N60B3D1的Datasheet PDF文件第7页 
XPTTM 600V IGBT  
GenX3TM w/ Diode  
IXXH50N60B3D1  
VCES = 600V  
IC110 = 50A  
VCE(sat)  1.80V  
tfi(typ) = 135ns  
Extreme Light Punch Through  
IGBT for 5-30kHz Switching  
TO-247  
Symbol  
Test Conditions  
Maximum Ratings  
VCES  
VCGR  
TJ = 25°C to 175°C  
600  
600  
V
V
TJ = 25°C to 175°C, RGE = 1M  
G
VGES  
VGEM  
Continuous  
Transient  
±20  
±30  
V
V
C
Tab  
=
E
IC25  
IC110  
IF110  
TC = 25°C( Chip Capability)  
TC = 110°C  
TC = 110°C  
120  
50  
30  
A
A
A
G = Gate  
E = Emitter  
C
Collector  
Tab = Collector  
ICM  
TC = 25°C, 1ms  
200  
A
IA  
EAS  
TC = 25°C  
TC = 25°C  
25  
A
200  
mJ  
A
Features  
SSOA  
VGE = 15V, TVJ = 150°C, RG = 5  
ICM = 100  
(RBSOA)  
Clamped Inductive Load  
@VCE VCES  
Optimized for 5-30kHz Switching  
Square RBSOA  
tsc  
VGE = 15V, VCE = 360V, TJ = 150°C  
10  
μs  
Anti-Parallel Ultra Fast Diode  
Avalanche Capability  
(SCSOA)  
RG = 22, Non Repetitive  
PC  
TC = 25°C  
600  
W
Short Circuit Capability  
International Standard Package  
TJ  
TJM  
Tstg  
-55 ... +175  
175  
°C  
°C  
°C  
-55 ... +175  
Advantages  
TL  
TSOLD  
Maximum Lead Temperature for Soldering  
1.6 mm (0.062in.) from Case for 10s  
300  
260  
°C  
°C  
High Power Density  
175°C Rated  
Extremely Rugged  
Low Gate Drive Requirement  
Md  
Mounting Torque  
1.13/10  
6
Nm/lb.in.  
g
Weight  
Applications  
Symbol  
Test Conditions  
Characteristic Values  
Power Inverters  
UPS  
(TJ = 25C, Unless Otherwise Specified)  
Min.  
600  
3.5  
Typ.  
Max.  
BVCES  
VGE(th)  
ICES  
IC = 250A, VGE = 0V  
IC = 250A, VCE = VGE  
VCE = VCES, VGE = 0V  
V
V
Motor Drives  
SMPS  
6.0  
PFC Circuits  
Battery Chargers  
Welding Machines  
Lamp Ballasts  
25 A  
3 mA  
TJ = 150C  
TJ = 150C  
IGES  
VCE = 0V, VGE = 20V  
100 nA  
VCE(sat)  
IC = 36A, VGE = 15V, Note 1  
1.55  
1.80  
1.80  
V
V
© 2013 IXYS CORPORATION, All Rights Reserved  
DS100302B(8/13)  

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