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IXTK250N10 PDF预览

IXTK250N10

更新时间: 2024-11-17 22:11:03
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IXYS /
页数 文件大小 规格书
2页 71K
描述
High Current MegaMOSFET

IXTK250N10 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-264AA包装说明:FLANGE MOUNT, R-PSFM-T3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:8.65
雪崩能效等级(Eas):4000 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (ID):250 A最大漏源导通电阻:0.005 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-264AA
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):1000 A认证状态:Not Qualified
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IXTK250N10 数据手册

 浏览型号IXTK250N10的Datasheet PDF文件第2页 
Advance Technical Information  
IXTK 250N10  
VDSS = 100 V  
High Current  
MegaMOSTMFET  
ID25  
= 250 A  
RDS(on)  
= 5 mΩ  
N-Channel Enhancement Mode  
Symbol  
Testconditions  
Maximum ratings  
TO-264AA(IXTK)  
VDSS  
VDGR  
TJ = 25°C to 150°C  
100  
100  
V
V
TJ = 25°C to 150°C; RGS = 1.0 MΩ  
VGS  
Continuous  
Transient  
±20  
±30  
V
V
VGSM  
D (TAB)  
G
ID25  
ID(RMS)  
IDM  
TC = 25°C MOSFET chip capability  
External lead current limit  
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
250  
75  
1000  
90  
A
D
S
A
A
A
IAR  
G = Gate  
D
= Drain  
S = Source  
Tab = Drain  
EAR  
EAS  
TC = 25°C  
TC = 25°C  
80  
4.0  
mJ  
J
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
5
V/ns  
PD  
TJ  
TC = 25°C  
730  
W
-55 ... +150  
°C  
TJM  
Tstg  
150  
-55 ... +150  
°C  
°C  
Features  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
International standard package  
Fast switching times  
TL  
1.6 mm (0.063 in.) from case for 10 s  
Mountingtorque  
300  
0.7/6  
10  
°C  
Nm/lb.in.  
g
Md  
Weight  
TO-264  
Applications  
Motor controls  
DC choppers  
Symbol Test Conditions  
Characteristic Values  
Switched-mode power supplies  
DC-DC Converters  
Linear Regulators  
(TJ = 25°C unless otherwise specified)  
Min. Typ.  
Max.  
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 1 mA  
100  
V
V
Advantages  
VDS = VGS, ID = 250 µA  
VGS = ±20 V DC, VDS = 0  
2.0  
4.0  
Easy to mount with one screw  
(isolated mounting screw hole)  
Space savings  
±200 nA  
High power density  
IDSS  
VDS = VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
50 µA  
1
mA  
RDS(on)  
VGS = 10 V, ID = 90 A  
5 mΩ  
Pulse test, t 300 ms, duty cycle d 2%  
© 2003 IXYS All rights reserved  
DS99022(03/03)  

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