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IXTK80N25 PDF预览

IXTK80N25

更新时间: 2024-02-25 03:13:14
品牌 Logo 应用领域
IXYS 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
5页 568K
描述
High Current MegaMOSTM FET

IXTK80N25 技术参数

是否Rohs认证: 符合生命周期:Not Recommended
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
风险等级:5.75雪崩能效等级(Eas):2500 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:250 V最大漏极电流 (ID):80 A
最大漏源导通电阻:0.033 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-264AAJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):320 A
认证状态:Not Qualified表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXTK80N25 数据手册

 浏览型号IXTK80N25的Datasheet PDF文件第2页浏览型号IXTK80N25的Datasheet PDF文件第3页浏览型号IXTK80N25的Datasheet PDF文件第4页浏览型号IXTK80N25的Datasheet PDF文件第5页 
IXTK 80N25 VDSS = 250 V  
High Current  
MegaMOSTMFET  
ID25  
= 80 A  
RDS(on) = 33 mΩ  
N-Channel Enhancement Mode  
PreliminaryDataSheet  
Symbol  
Testconditions  
Maximum ratings  
TO-264AA(IXTK)  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1.0 MΩ  
250  
250  
V
V
VGS  
Continuous  
Transient  
±20  
±30  
V
V
VGSM  
D (TAB)  
G
ID25  
ID(RMS)  
IDM  
T
= 25°C MOSFET chip capability  
80  
75  
A
ECxternal lead current limit  
A
A
A
D
S
T
= 25°C, pulse width limited by TJM  
320  
80  
IAR  
TCC = 25°C  
G = Gate  
S = Source  
D
= Drain  
Tab = Drain  
EAR  
EAS  
T
= 25°C  
60  
2.5  
mJ  
J
TCC = 25°C  
Features  
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
5
V/ns  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
International standard package  
Fast switching times  
PD  
TJ  
TC = 25°C  
540  
W
-55 ... +150  
°C  
TJM  
Tstg  
150  
-55 ... +150  
°C  
°C  
Applications  
TL  
1.6 mm (0.063 in.) from case for 10 s  
Mountingtorque  
300  
0.7/6  
10  
°C  
Nm/lb.in.  
g
Motor controls  
Md  
DC choppers  
Weight  
TO-264  
Switched-mode power supplies  
Advantages  
Easy to mount with one screw  
(isolated mounting screw hole)  
Space savings  
Symbol Test Conditions  
Characteristic Values  
(TJ = 25°C unless otherwise specified)  
Min. Typ.  
Max.  
High power density  
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 1 mA  
250  
V
V
VDS = VGS, ID = 250 µA  
VGS = ±20 V DC, VDS = 0  
2.0  
4.0  
±100 nA  
IDSS  
VDS = V  
T = 25°C  
50 µA  
VGS = 0 DVSS  
TJJ = 125°C  
2
mA  
RDS(on)  
VGS = 10 V, I = 0.5 I  
33 mΩ  
Pulse test, t D300 msD,2d5 uty cycle d 2%  
© 2003 IXYS All rights reserved  
DS98953A(11/03)  

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