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IRF7NA2907SCS PDF预览

IRF7NA2907SCS

更新时间: 2024-11-19 21:12:55
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
7页 172K
描述
Power Field-Effect Transistor, 75A I(D), 75V, 0.0045ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETICALLY SEALED, SMD-2, 3 PIN

IRF7NA2907SCS 技术参数

生命周期:Active包装说明:CHIP CARRIER, R-XBCC-N3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.66雪崩能效等级(Eas):500 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:75 V最大漏极电流 (ID):75 A
最大漏源导通电阻:0.0045 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XBCC-N3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:CHIP CARRIER极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):300 A表面贴装:YES
端子形式:NO LEAD端子位置:BOTTOM
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF7NA2907SCS 数据手册

 浏览型号IRF7NA2907SCS的Datasheet PDF文件第2页浏览型号IRF7NA2907SCS的Datasheet PDF文件第3页浏览型号IRF7NA2907SCS的Datasheet PDF文件第4页浏览型号IRF7NA2907SCS的Datasheet PDF文件第5页浏览型号IRF7NA2907SCS的Datasheet PDF文件第6页浏览型号IRF7NA2907SCS的Datasheet PDF文件第7页 
PD-94337C  
HEXFET® POWER MOSFET  
SURFACE MOUNT (SMD-2)  
IRF7NA2907  
75V, N-CHANNEL  
Product Summary  
Part Number  
BV  
RDS(on)  
ID  
DSS  
IRF7NA2907  
75V  
0.004575A*  
Seventh Generation HEXFET® power MOSFETs from  
International Rectifier utilize advanced processing  
techniquestoachievethelowestpossibleon-resistance  
per silicon unit area. This benefit, combined with the  
fast switching speed and ruggedized device design  
that HEXFET power MOSFETs are well known for,  
providesthedesignerwithanextremelyefficientdevice  
for use in a wide variety of applications.  
These devices are well-suited for applications such  
as switching power supplies, motor controls, inverters,  
choppers, audio amplifiers and high-energy pulse  
circuits.  
SMD-2  
Features:  
n
n
n
n
n
n
n
n
Low RDS(on)  
Avalanche Energy Ratings  
Dynamic dv/dt Rating  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Surface Mount  
Light Weight  
Absolute Maximum Ratings  
Parameter  
Units  
I
@ V  
@ V  
= 10V, T = 25°C  
Continuous Drain Current  
75*  
75*  
D
D
GS  
GS  
C
A
I
= 10V, T = 100°C Continuous Drain Current  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
300  
DM  
@ T = 25°C  
P
D
250  
W
W/°C  
V
C
Linear Derating Factor  
2.0  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
±20  
GS  
E
500  
mJ  
A
AS  
I
75  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
25  
mJ  
V/ns  
AR  
dv/dt  
6.4  
T
-55 to 150  
J
T
Storage Temperature Range  
oC  
g
STG  
Package Mounting Surface Temp.  
Weight  
300 (for 5s)  
3.3 (Typical)  
* Current is limited by package  
For footnotes refer to the last page  
www.irf.com  
1
01/27/15  

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