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IRF6655TRPBF PDF预览

IRF6655TRPBF

更新时间: 2024-09-09 04:23:15
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
10页 273K
描述
DirectFET Power MOSFET

IRF6655TRPBF 技术参数

是否Rohs认证:符合生命周期:Obsolete
包装说明:ROHS COMPLIANT, ISOMETRIC-2Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:7.13
Is Samacsys:N雪崩能效等级(Eas):11 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):4.2 A
最大漏极电流 (ID):4.2 A最大漏源导通电阻:0.062 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-XBCC-N2
JESD-609代码:e1湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):42 W
最大脉冲漏极电流 (IDM):34 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF6655TRPBF 数据手册

 浏览型号IRF6655TRPBF的Datasheet PDF文件第2页浏览型号IRF6655TRPBF的Datasheet PDF文件第3页浏览型号IRF6655TRPBF的Datasheet PDF文件第4页浏览型号IRF6655TRPBF的Datasheet PDF文件第5页浏览型号IRF6655TRPBF的Datasheet PDF文件第6页浏览型号IRF6655TRPBF的Datasheet PDF文件第7页 
PD - 97226A  
IRF6655PbF  
IRF6655TRPbF  
DirectFET™ Power MOSFET ‚  
Typical values (unless otherwise specified)  
l RoHs Compliant   
RDS(on)  
VDSS  
VGS  
l Lead-Free (Qualified up to 260°C Reflow)  
l Application Specific MOSFETs  
53m@ 10V  
100V max ±20V max  
l Ideal for High Performance Isolated Converter  
Primary Switch Socket  
l Ideal for Control FET sockets in 36V-75V in  
Synchronous Buck applications  
Qg tot Qgd  
Qgs2  
Qrr  
Qoss Vgs(th)  
8.7nC 2.8nC 0.58nC 37nC  
4.5nC  
4.0V  
l Low Conduction Losses  
l High Cdv/dt Immunity  
l Low Profile (<0.7mm)  
l Dual Sided Cooling Compatible   
l Compatible with existing Surface Mount Techniques   
DirectFET™ ISOMETRIC  
SH  
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)  
SQ  
SX  
ST  
SH  
MQ  
MX  
MT  
MN  
Description  
The IRF6655PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the  
lowest combined on-state resistance and gate charge in a package that has a footprint similar to that of a micro-8, and only 0.7mm profile. The  
DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-  
red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The  
DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by  
80%.  
The IRF6655PbF is optimized for low power primary side bridge topologies in isolated DC-DC applications, and for high side control FET sockets  
in non-isolated synchronous buck DC-DC applications for use in wide range universal Telecom systems (36V – 75V), and for secondary side  
synchronous rectification in regulated DC-DC topologies. The reduced total losses in the device coupled with the high level of thermal perfor-  
mance enables high efficiency and low temperatures, which are key for system reliability improvements, and makes this device ideal for high  
performance isolated DC-DC converters.  
Absolute Maximum Ratings  
Max.  
100  
±20  
4.2  
3.4  
19  
Parameter  
Units  
V
VDS  
Drain-to-Source Voltage  
V
Gate-to-Source Voltage  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
I
@ TA = 25°C  
D
D
D
@ TA = 70°C  
@ TC = 25°C  
A
34  
DM  
EAS  
IAR  
11  
Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
5.0  
200  
180  
160  
140  
120  
100  
80  
12.0  
10.0  
8.0  
V
V
V
= 80V  
I = 5.0A  
D
I
= 5.0A  
DS  
DS  
DS  
D
= 50V  
= 20V  
T
= 125°C  
J
6.0  
4.0  
60  
40  
20  
0
2.0  
T
= 25°C  
12  
J
0.0  
4
6
8
10  
14  
16  
18  
0
2
4
6
8
10  
Q
Total Gate Charge (nC)  
G
V
Gate -to -Source Voltage (V)  
GS,  
Fig 1. Typical On-Resistance vs. Gate Voltage  
Fig 2. Typical On-Resistance Vs. Gate Voltage  
Notes:  
„ TC measured with thermocouple mounted to top (Drain) of part.  
Repetitive rating; pulse width limited by max. junction temperature.  
† Starting TJ = 25°C, L = 0.89mH, RG = 25, IAS = 5.0A.  
 Click on this section to link to the appropriate technical paper.  
‚ Click on this section to link to the DirectFET Website.  
ƒ Surface mounted on 1 in. square Cu board, steady state.  
www.irf.com  
1
08/25/06  

IRF6655TRPBF 替代型号

型号 品牌 替代类型 描述 数据表
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