PD - 96979F
IRF6678
DirectFET Power MOSFET
Typical values (unless otherwise specified)
l RoHS compliant containing no lead or bormide
l Low Profile (<0.7 mm)
VDSS
30V max ±20V max
VGS
RDS(on)
RDS(on)
1.7mΩ@ 10V 2.3mΩ@ 4.5V
l Dual Sided Cooling Compatible
l Ultra Low Package Inductance
Qg tot Qgd
Qgs2
Qrr
Qoss Vgs(th)
43nC
15nC
4.0nC
46nC
28nC
1.8V
l Optimized for High Frequency Switching
l Ideal for CPU Core DC-DC Converters
l Optimized for for SyncFET Socket of Sync. Buck Converter
l Low Conduction and Switching Losses
l Compatible with Existing Surface Mount Techniques
DirectFET ISOMETRIC
MX
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
SQ
SX
ST
MQ
MX
MT
Description
The IRF6678 combines the latest HEXFET® power MOSFET silicon technology with advanced DirectFETTM packaging to achieve the lowest
on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing
layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,
when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided
cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6678 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching
losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors
operating at higher frequencies. The IRF6678 has been optimized for parameters that are critical in synchronous buck operating from 12 volt
bus converters including RDS(on) and gate charge to minimize losses in the SyncFET socket.
Absolute Maximum Ratings
Max.
30
Parameter
Units
V
VDS
Drain-to-Source Voltage
±20
30
V
Gate-to-Source Voltage
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
I
@ TA = 25°C
D
D
D
24
@ TA = 70°C
@ TC = 25°C
A
150
240
210
24
DM
EAS
IAR
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
20
15
10
5
6.0
5.0
4.0
3.0
2.0
1.0
0.0
I = 23A
D
I
= 29A
D
V
= 24V
= 15V
DS
V
DS
T
= 125°C
J
T
3
= 25°C
J
0
0
1
2
4
5
6
7
8
9
10
0
10
20
30
40
50
60
Q
Total Gate Charge (nC)
G
V
Gate -to -Source Voltage (V)
GS,
Fig 1. Typical On-Resistance vs. Gate Voltage
Fig 2. Typical On-Resistance vs. Gate Voltage
Notes:
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET MOSFETs.
Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 0.75mH, RG = 25Ω, IAS = 23A.
Surface mounted on 1 in. square Cu board, steady state.
TC measured with thermocouple mounted to top (Drain) of part.
www.irf.com
1
02/28/06