是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | CHIP CARRIER, R-XBCC-N2 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | 风险等级: | 5.3 |
其他特性: | HIGH RELIABILITY | 雪崩能效等级(Eas): | 11 mJ |
外壳连接: | DRAIN | 配置: | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压: | 100 V | 最大漏极电流 (ID): | 4.2 A |
最大漏源导通电阻: | 0.062 Ω | FET 技术: | METAL-OXIDE SEMICONDUCTOR |
JESD-30 代码: | R-XBCC-N2 | JESD-609代码: | e4 |
湿度敏感等级: | 3 | 元件数量: | 1 |
端子数量: | 2 | 工作模式: | ENHANCEMENT MODE |
最高工作温度: | 150 °C | 封装主体材料: | UNSPECIFIED |
封装形状: | RECTANGULAR | 封装形式: | CHIP CARRIER |
峰值回流温度(摄氏度): | 260 | 极性/信道类型: | N-CHANNEL |
最大脉冲漏极电流 (IDM): | 34 A | 认证状态: | Not Qualified |
表面贴装: | YES | 端子面层: | Silver/Nickel (Ag/Ni) |
端子形式: | NO LEAD | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 晶体管应用: | SWITCHING |
晶体管元件材料: | SILICON |
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