PD - 97133
IRF6674TRPbF
DirectFET Power MOSFET
Typical values (unless otherwise specified)
l RoHS Compliant
VDSS
VGS
RDS(on)
9.0mΩ@ 10V
Vgs(th)
l Lead-Free (Qualified up to 260°C Reflow)
l Application Specific MOSFETs
60V max ±20V max
Qg tot
Qgd
l Ideal for High Performance Isolated Converter
Primary Switch Socket
l Optimized for Synchronous Rectification
24nC
8.3nC
4.0V
l Low Conduction Losses
l High Cdv/dt Immunity
l Dual Sided Cooling Compatible
l Compatible with existing Surface Mount Techniques
DirectFET ISOMETRIC
MZ
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
SH
SJ
SP
MZ
MN
Description
The IRF6674PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve
the lowest on-state resistance in a package that has the footprint of an Micro8 and only 0.7 mm profile. The DirectFET package is compatible
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering
techniques, when application noteAN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows
dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6674PbF is optimized for primary side sockets in forward and push-pull isolated DC-DC topologies, for 48V and 36V-60V input
voltage range systems. The reduced total losses in the device coupled with the high level of thermal performance enables high efficiency
and low temperatures, which are key for system reliability improvements, and makes this device ideal for high performance isolated DC-
DC converters.
Absolute Maximum Ratings
Max.
60
Parameter
Units
V
VDS
Drain-to-Source Voltage
±20
13.4
10.7
67
Gate-to-Source Voltage
V
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
I
@ TA = 25°C
D
D
D
A
@ TA = 70°C
@ TC = 25°C
134
98
DM
EAS
IAS
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
13.4
14
12
10
8
50
40
30
20
10
0
I = 13.4A
D
V
= 48V
= 30V
I
= 13.4A
DS
D
V
DS
6
T
= 125°C
J
4
2
T
= 25°C
14
J
0
4
6
8
10
12
16
0
10
20
30
V
, Gate-to-Source Voltage (V)
GS
Q
Total Gate Charge (nC)
G
Fig 1. Typical On-Resistance vs. Gate Voltage
Fig 2. Typical Total Gate Charge vs. Gate-to-Source Voltage
Notes:
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 0.272mH, RG = 25Ω, IAS = 13.4A.
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
www.irf.com
1
4/24/08