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FDMC8026S PDF预览

FDMC8026S

更新时间: 2024-11-09 12:31:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
8页 386K
描述
N-Channel PowerTrench® SyncFETTM

FDMC8026S 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:MLP
包装说明:SMALL OUTLINE, S-PDSO-N5针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.7
Is Samacsys:N雪崩能效等级(Eas):66 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):21 A
最大漏极电流 (ID):19 A最大漏源导通电阻:0.0044 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-PDSO-N5
JESD-609代码:e4湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):36 W
最大脉冲漏极电流 (IDM):100 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDMC8026S 数据手册

 浏览型号FDMC8026S的Datasheet PDF文件第2页浏览型号FDMC8026S的Datasheet PDF文件第3页浏览型号FDMC8026S的Datasheet PDF文件第4页浏览型号FDMC8026S的Datasheet PDF文件第5页浏览型号FDMC8026S的Datasheet PDF文件第6页浏览型号FDMC8026S的Datasheet PDF文件第7页 
June 2013  
FDMC8026S  
N-Channel PowerTrench® SyncFETTM  
30 V, 21 A, 4.4 mΩ  
Features  
General Description  
The FDMC8026S has been designed to minimize losses in  
power conversion application. Advancements in both silicon and  
package technologies have been combined to offer the lowest  
rDS(on) while maintaining excellent switching performance.This  
device has the added benefit of an efficient monolithic schottky  
body diode.  
„ Max rDS(on) = 4.4 mΩ at VGS = 10 V, ID = 19 A  
„ Max rDS(on) = 5.2 mΩ at VGS = 4.5 V, ID = 17.5 A  
„ Advanced package and silicon combination for low rDS(on) and  
high efficiency  
„ SyncFET Schottky Body Diode  
„ MSL1 robust package design  
„ 100% UIL tested  
Applications  
„ Synchronous Rectifier for DC/DC Converters  
„ Notebook Vcore/GPU low side switch  
„ Networking Point of Load low side switch  
„ Telecom secondary side rectification  
„ RoHS Compliant  
Bottom  
Top  
G
S
S
S
D
D
D
D
5
6
7
8
4
3
Pin 1  
G
S
S
S
2
1
D
D
D
D
MLP 3.3x3.3  
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
30  
V
V
(Note 4)  
±20  
Drain Current -Continuous (Package limited)  
-Continuous (Silicon limited)  
-Continuous  
TC = 25°C  
C = 25°C  
21  
T
76  
ID  
A
TA = 25°C  
(Note 1a)  
(Note 3)  
19  
100  
-Pulsed  
EAS  
Single Pulse Avalance Energy  
Power Dissipation  
66  
mJ  
W
TC = 25°C  
TA = 25°C  
36  
PD  
Power Dissipation  
(Note 1a)  
2.4  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
3.4  
53  
°C/W  
(Note 1a)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13 ’’  
Tape Width  
12 mm  
Quantity  
FDMC8026S  
FDMC8026S  
MLP 3.3X3.3  
3000 units  
©2013 Fairchild Semiconductor Corporation  
FDMC8026S Rev.C4  
www.fairchildsemi.com  
1

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