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FDMC8296 PDF预览

FDMC8296

更新时间: 2024-11-18 03:36:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
7页 297K
描述
N-Channel Power Trench㈢ MOSFET 30V, 18A, 8.0mヘ

FDMC8296 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:MLP
包装说明:SMALL OUTLINE, S-PDSO-N5针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:3.31
其他特性:ULTRA-LOW RESISTANCE雪崩能效等级(Eas):72 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):44 A
最大漏极电流 (ID):12 A最大漏源导通电阻:0.008 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-PDSO-N5
JESD-609代码:e4湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):27 W
最大脉冲漏极电流 (IDM):52 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDMC8296 数据手册

 浏览型号FDMC8296的Datasheet PDF文件第2页浏览型号FDMC8296的Datasheet PDF文件第3页浏览型号FDMC8296的Datasheet PDF文件第4页浏览型号FDMC8296的Datasheet PDF文件第5页浏览型号FDMC8296的Datasheet PDF文件第6页浏览型号FDMC8296的Datasheet PDF文件第7页 
March 2008  
FDMC8296  
tm  
N-Channel Power Trench® MOSFET  
30V, 18A, 8.0mΩ  
Features  
General Description  
„ Max rDS(on) = 8.0mat VGS = 10V, ID = 12A  
„ Max rDS(on) = 13.0mat VGS = 4.5V, ID = 10A  
„ High performance trench technology for extremely low rDS(on)  
„ Termination is Lead-free and RoHS Compliant  
This N-Channel MOSFET is produced using Fairchild  
Semiconductor‘s advanced Power Trench® process that has  
been especially tailored to minimize the on-state resistance. This  
device is welll suited for Power Management and load switching  
applications common in Notebook Computers and Portable  
Battery Packs.  
Application  
„ High side in DC - DC Buck Converters  
„ Notebook battery power management  
„ Load switch in Notebook  
Pin 1  
S
S
S
4
3
2
1
G
S
S
S
D
D
5
6
7
8
G
D
D
D
D
D
D
TOP  
Bottom  
Power 33  
MOSFET Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
30  
V
V
±20  
Drain Current -Continuous (Package limited)  
-Continuous (Silicon limited)  
-Continuous  
TC = 25°C  
C = 25°C  
18  
T
44  
ID  
A
TA = 25°C  
(Note 1a)  
(Note 3)  
12  
-Pulsed  
52  
EAS  
Single Pulse Avalanche Energy  
Power Dissipation  
60  
27  
mJ  
W
TC = 25°C  
TA = 25°C  
PD  
Power Dissipation  
(Note 1a)  
2.3  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
4.6  
53  
°C/W  
(Note 1a)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13’’  
Tape Width  
12mm  
Quantity  
FDMC8296  
FDMC8296  
Power 33  
3000 units  
1
©2008 Fairchild Semiconductor Corporation  
FDMC8296 Rev.B  
www.fairchildsemi.com  

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