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FDMC8296_10 PDF预览

FDMC8296_10

更新时间: 2024-11-18 12:23:35
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
7页 372K
描述
N-Channel Power Trench® MOSFET 30V, 18A, 8.0m

FDMC8296_10 数据手册

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September 2010  
FDMC8296  
N-Channel Power Trench® MOSFETꢀ  
30V, 18A, 8.0m  
Features  
General Description  
  Max rDS(on) = 8.0mat VGS = 10V, ID = 12A  
  Max rDS(on) = 13.0mat VGS = 4.5V, ID = 10A  
  High performance trench technology for extremely low rDS(on)  
  Termination is Lead-free and RoHS Compliant  
This N-Channel MOSFET is produced using Fairchild  
Semiconductor‘s advanced Power Trench® process that has  
been especially tailored to minimize the on-state resistance. This  
device is well suited for Power Management and load switching  
applications common in Notebook Computers and Portable  
Battery Packs.  
Application  
  DC - DC Buck Converter  
  Notebook battery power management  
  Load switch in Notebook  
Bottom  
Top  
Pin 1  
4
3
2
1
G
S
S
S
G
5
6
7
8
D
D
D
D
S
S
S
D
D
D
D
MLP 3.3x3.3  
MOSFET Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
30  
Units  
V
V
Drain to Source Voltage  
Gate to Source Voltage  
20  
Drain Current -Continuous (Package limited)  
-Continuous (Silicon limited)  
-Continuous  
TC = 25°C  
TC = 25°C  
TA = 25°C  
18  
44  
12  
52  
72  
27  
2.3  
ID  
A
(Note 1a)  
(Note 3)  
-Pulsed  
EAS  
Single Pulse Avalanche Energy  
Power Dissipation  
Power Dissipation  
mJ  
W
TC = 25°C  
PD  
TA = 25°C  
(Note 1a)  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RJC  
RJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
4.6  
53  
°C/W  
(Note 1a)  
Package Marking and Ordering Information  
Device Marking  
FDMC8296  
Device  
FDMC8296  
Package  
MLP 3.3X3.3  
Reel Size  
13 ’’  
Tape Width  
12 mm  
Quantity  
3000 units  
1
©2010 Fairchild Semiconductor Corporation  
FDMC8296 Rev.C1  
www.fairchildsemi.com  

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