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FDMC8030 PDF预览

FDMC8030

更新时间: 2024-11-19 11:13:23
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 265K
描述
双 N 沟道,Power Trench® MOSFET,40V,12A,10mΩ

FDMC8030 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, S-PDSO-N8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:0.95Samacsys Confidence:4
Samacsys Status:ReleasedSamacsys PartID:838781
Samacsys Pin Count:10Samacsys Part Category:MOSFET (N-Channel)
Samacsys Package Category:OtherSamacsys Footprint Name:WDFN8 3x3, 0.65P CASE 511DG ISSUE O
Samacsys Released Date:2018-06-11 11:55:07Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):21 mJ
外壳连接:DRAIN SOURCE配置:SEPARATE, 2 ELEMENTS
最小漏源击穿电压:40 V最大漏极电流 (Abs) (ID):12 A
最大漏极电流 (ID):12 A最大漏源导通电阻:0.01 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):30 pF
JESD-30 代码:S-PDSO-N8JESD-609代码:e4
湿度敏感等级:1元件数量:2
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
功耗环境最大值:14 W最大功率耗散 (Abs):14 W
最大脉冲漏极电流 (IDM):50 A表面贴装:YES
端子面层:Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)端子形式:NO LEAD
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICON最大关闭时间(toff):43 ns
最大开启时间(吨):23 nsBase Number Matches:1

FDMC8030 数据手册

 浏览型号FDMC8030的Datasheet PDF文件第2页浏览型号FDMC8030的Datasheet PDF文件第3页浏览型号FDMC8030的Datasheet PDF文件第4页浏览型号FDMC8030的Datasheet PDF文件第5页浏览型号FDMC8030的Datasheet PDF文件第6页浏览型号FDMC8030的Datasheet PDF文件第7页 
DATA SHEET  
www.onsemi.com  
MOSFET – Dual N-Channel,  
POWERTRENCH)  
Bottom Drain2 Contact  
G2  
S2  
G1  
S1  
S1  
S1  
8
7
1
2
40 V, 12 A, 10 mW  
Q2  
Q1  
FDMC8030  
S2  
S2  
6
5
3
4
General Description  
Bottom Drain1 Contact  
This device includes two 40 V NChannel MOSFETs in a dual  
Power 33 (3 mm x 3 mm MLP) package. The package is enhanced for  
exceptional thermal performance.  
Features  
Pin 1  
G1 S1 S1 S1  
Max r  
Max r  
Max r  
= 10 mW at V = 10 V, I = 12 A  
GS D  
DS(on)  
DS(on)  
DS(on)  
= 14 mW at V = 4.5 V, I = 10 A  
GS  
D
D1  
D2  
= 28 mW at V = 3.2 V, I = 4 A  
GS  
D
This Device is PbFree and is RoHS Compliant  
Applications  
Battery Protection  
Load Switching  
Point of Load  
G2 S2 S2 S2  
Power 33  
WDFN8 3x3, 0.65P  
CASE 511DG  
MOSFET MAXIMUM RATINGS (TA = 25°C unless otherwise noted)  
Symbol  
VDS  
Parameter  
Drain to Source Voltage  
Ratings Units  
MARKING DIAGRAM  
40  
12  
V
V
A
VGS  
Gate to Source Voltage  
(Note 4)  
$Y&Z&2&K  
FDMC  
ID  
Drain Current  
8030  
Continuous  
Pulsed  
TA = 25°C  
(Note 1a)  
12  
50  
EAS  
PD  
Single Pulse Avalanche Energy  
Power Dissipation TC = 25°C  
Power Dissipation TA = 25°C  
(Note 3)  
21  
14  
mJ  
W
$Y  
= onsemi Logo  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
&Z  
&2  
&K  
(Note 1a)  
1.9  
FDMC8030  
= Specific Device Code  
TJ, TSTG Operating and Storage Junction Temperature  
Range  
55 to  
+150  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
March, 2023 Rev. 2  
FDMC8030/D  

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