DATA SHEET
www.onsemi.com
Dual, N-Channel, Digital FET
FDC6301N
D2
S1
D1
G2
S2
G1
General Description
These dual N−Channel logic level enhancement mode field effect
transistors are produced using onsemi’s proprietary, high cell density,
DMOS technology. This very high density process is especially
tailored to minimize on−state resistance. This device has been
designed especially for low voltage applications as a replacement for
digital transistors. Since bias resistors are not required, these
N−Channel FET’s can replace several digital transistors, with a variety
of bias resistors.
TSOT23 6−Lead
SUPERSOTt−6
CASE 419BL
MARKING DIAGRAM
301 MG
G
Features
1
• 25 V, 0.22 A Continuous, 0.5 A Peak
301 = Specific Device Code
♦ R
♦ R
= 5 W @ V = 2.7 V
GS
DS(on)
M
= Assembly Operation Month
= 4 W @ V = 4.5 V
DS(on)
GS
G
= Pb−Free Package
• Very Low Level Gate Drive Requirements Allowing Direct
Operation in 3 V Circuits. V < 1.5 V
(Note: Microdot may be in either location)
GS(th)
• Gate−Source Zener for ESD Ruggedness. >6 kV Human Body Model
• This is a Pb−Free and Halide Free Device
PIN ASSIGNMENT
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
3
2
1
4
5
Symbol
, V
Parameter
Ratings
Unit
V
Drain−Source Voltage,
25
V
DSS
CC
Power Supply Voltage
Gate−Source Voltage, V
Drain / Output Current
V
GSS
, V
IN
−0.5 to + 8
0.22
V
A
IN
I , I
− Continuous
− Pulsed
D
OUT
6
0.5
P
D
Maximum Power
Dissipation
(Note 1a)
(Note 1b)
0.9
W
0.7
T , T
Operating and Storage Temperature
Range
−55 to +150
°C
J
STG
INVERTER APPLICATION
V
CC
ESD
Electrostatic Discharge Rating
MIL−STD−883D Human Body Model
(100 pF / 1500 W)
6.0
kV
D
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
OUT
GND
THERMAL CHARACTERISTICS
IN
G
S
Symbol
Parameter
Ratings
Unit
RqJA
Thermal Resistance, Junction−to−Ambient
(Note 1a)
140
°C/W
RqJC
Thermal Resistance, Junction−to−Case
(Note 1)
60
°C/W
ORDERING INFORMATION
†
Device
Package
Shipping
FDC6301N
TSOT−23−6
(SUPERSOTt−6)
(Pb−Free)
3000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
May, 2023 − Rev. 5
FDC6301N/D