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FDC6301N PDF预览

FDC6301N

更新时间: 2024-09-16 11:15:27
品牌 Logo 应用领域
安森美 - ONSEMI 开关光电二极管晶体管
页数 文件大小 规格书
6页 315K
描述
双 N 沟道,数字 FET,25V,0.22A,4Ω

FDC6301N 数据手册

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DATA SHEET  
www.onsemi.com  
Dual, N-Channel, Digital FET  
FDC6301N  
D2  
S1  
D1  
G2  
S2  
G1  
General Description  
These dual NChannel logic level enhancement mode field effect  
transistors are produced using onsemi’s proprietary, high cell density,  
DMOS technology. This very high density process is especially  
tailored to minimize onstate resistance. This device has been  
designed especially for low voltage applications as a replacement for  
digital transistors. Since bias resistors are not required, these  
NChannel FET’s can replace several digital transistors, with a variety  
of bias resistors.  
TSOT23 6Lead  
SUPERSOTt6  
CASE 419BL  
MARKING DIAGRAM  
301 MG  
G
Features  
1
25 V, 0.22 A Continuous, 0.5 A Peak  
301 = Specific Device Code  
R  
R  
= 5 W @ V = 2.7 V  
GS  
DS(on)  
M
= Assembly Operation Month  
= 4 W @ V = 4.5 V  
DS(on)  
GS  
G
= PbFree Package  
Very Low Level Gate Drive Requirements Allowing Direct  
Operation in 3 V Circuits. V < 1.5 V  
(Note: Microdot may be in either location)  
GS(th)  
GateSource Zener for ESD Ruggedness. >6 kV Human Body Model  
This is a PbFree and Halide Free Device  
PIN ASSIGNMENT  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)  
3
2
1
4
5
Symbol  
, V  
Parameter  
Ratings  
Unit  
V
DrainSource Voltage,  
25  
V
DSS  
CC  
Power Supply Voltage  
GateSource Voltage, V  
Drain / Output Current  
V
GSS  
, V  
IN  
0.5 to + 8  
0.22  
V
A
IN  
I , I  
Continuous  
Pulsed  
D
OUT  
6
0.5  
P
D
Maximum Power  
Dissipation  
(Note 1a)  
(Note 1b)  
0.9  
W
0.7  
T , T  
Operating and Storage Temperature  
Range  
55 to +150  
°C  
J
STG  
INVERTER APPLICATION  
V
CC  
ESD  
Electrostatic Discharge Rating  
MILSTD883D Human Body Model  
(100 pF / 1500 W)  
6.0  
kV  
D
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
OUT  
GND  
THERMAL CHARACTERISTICS  
IN  
G
S
Symbol  
Parameter  
Ratings  
Unit  
RqJA  
Thermal Resistance, JunctiontoAmbient  
(Note 1a)  
140  
°C/W  
RqJC  
Thermal Resistance, JunctiontoCase  
(Note 1)  
60  
°C/W  
ORDERING INFORMATION  
Device  
Package  
Shipping  
FDC6301N  
TSOT236  
(SUPERSOTt6)  
(PbFree)  
3000 /  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
May, 2023 Rev. 5  
FDC6301N/D  

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