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FDC6310P PDF预览

FDC6310P

更新时间: 2024-11-04 22:49:03
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管开关光电二极管PC
页数 文件大小 规格书
5页 70K
描述
Dual P-Channel 2.5V Specified PowerTrench MOSFET

FDC6310P 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:SSOT
包装说明:SMALL OUTLINE, R-PDSO-G6针数:6
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.31
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (ID):2.2 A最大漏源导通电阻:0.125 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G6
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):0.96 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDC6310P 数据手册

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April 2001  
FDC6310P  
Dual P-Channel 2.5V Specified PowerTrenchÒ MOSFET  
General Description  
Features  
These P-Channel 2.5V specified MOSFETs are  
produced using Fairchild Semiconductor's advanced  
PowerTrench process that has been especially tailored  
to minimize on-state resistance and yet maintain low  
gate charge for superior switching performance.  
· –2.2 A, –20 V. RDS(ON) = 125 mW @ VGS = –4.5 V  
RDS(ON) = 190 mW @ VGS = –2.5 V  
· Low gate charge  
These devices have been designed to offer exceptional  
· Fast switching speed  
power dissipation in  
a very small footprint for  
applications where the bigger more expensive SO-8  
and TSSOP-8 packages are impractical.  
· High performance trench technology for extremely  
low RDS(ON)  
Applications  
· SuperSOT TM -6 package: small footprint 72%  
smaller than standard SO-8); low profile (1mm thick)  
· Load switch  
· Battery protection  
· Power management  
D2  
S1  
4
5
6
3
2
1
D1  
G2  
S2  
SuperSOT TM-6  
G1  
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
Parameter  
Ratings  
Units  
VDSS  
Drain-Source Voltage  
–20  
V
VGSS  
ID  
Gate-Source Voltage  
±12  
–2.2  
V
A
Drain Current – Continuous  
– Pulsed  
(Note 1a)  
–6  
PD  
Power Dissipation for Single Operation  
(Note 1a)  
(Note 1b)  
(Note 1c)  
0.96  
W
0.9  
0.7  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
–55 to +150  
°C  
Thermal Characteristics  
Thermal Resistance, Junction-to-Ambient  
Thermal Resistance, Junction-to-Case  
(Note 1a)  
(Note 1)  
130  
60  
RqJA  
°C/W  
°C/W  
RqJC  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
.310  
FDC6310P  
7’’  
8mm  
3000 units  
Ó2001 Fairchild Semiconductor Corporation  
FDC6310P Rev C(W)  

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