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FDC6318P PDF预览

FDC6318P

更新时间: 2024-09-15 22:49:03
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管开关光电二极管
页数 文件大小 规格书
5页 166K
描述
Dual P-Channel 1.8V PowerTrench Specified MOSFET

FDC6318P 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:SSOT
包装说明:SMALL OUTLINE, R-PDSO-G6针数:6
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.31
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:12 V
最大漏极电流 (Abs) (ID):2.5 A最大漏极电流 (ID):2.5 A
最大漏源导通电阻:0.09 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G6JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:6工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):0.7 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDC6318P 数据手册

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December 2001  
FDC6318P  
Dual P-Channel 1.8V PowerTrenchSpecified MOSFET  
General Description  
Features  
These P-Channel 1.8V specified MOSFETs are  
produced using Fairchild Semiconductor's advanced  
PowerTrench process that has been especially tailored  
to minimize on-state resistance and yet maintain low  
gate charge for superior switching performance.  
–2.5 A, –12 V. RDS(ON)  
=
90 m@ VGS = –4.5 V  
R
R
DS(ON) = 125 m@ VGS = –2.5 V  
DS(ON) = 200 m@ VGS = –1.8 V  
High performance trench technology for extremely  
low RDS(ON)  
Applications  
Power management  
Load switch  
SuperSOTTM-6 package: small footprint (72%  
smaller than standard SO-8); low profile (1mm thick)  
D2  
S1  
4
5
6
3
2
1
D1  
G2  
S2  
SuperSOT TM-6  
G1  
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
Parameter  
Ratings  
Units  
VDSS  
Drain-Source Voltage  
–12  
V
V
A
VGSS  
Gate-Source Voltage  
8
–2.5  
–7  
ID  
Drain Current – Continuous  
– Pulsed  
(Note 1a)  
Power Dissipation for Single Operation  
(Note 1a)  
(Note 1b)  
(Note 1c)  
0.96  
0.9  
0.7  
PD  
W
TJ, TSTG  
Operating and Storage Junction Temperature Range  
–55 to +150  
°C  
Thermal Characteristics  
°C/W  
°C/W  
Thermal Resistance, Junction-to-Ambient  
Thermal Resistance, Junction-to-Case  
(Note 1a)  
(Note 1)  
130  
60  
RθJA  
RθJC  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
.318  
FDC6318P  
13’’  
12mm  
3000 units  
FDC6318P Rev D (W)  
2001 Fairchild Semiconductor Corporation  

FDC6318P 替代型号

型号 品牌 替代类型 描述 数据表
FDC6306P FAIRCHILD

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