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AUIRFZ44NSTRL PDF预览

AUIRFZ44NSTRL

更新时间: 2024-02-23 10:56:42
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
13页 279K
描述
AUTOMOTIVE GRADE

AUIRFZ44NSTRL 数据手册

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PD-96391A  
AUTOMOTIVE GRADE  
AUIRFZ44NS  
AUIRFZ44NL  
HEXFET® Power MOSFET  
Features  
D
S
AdvancedPlanarTechnology  
LowOn-Resistance  
Dynamic dV/dT Rating  
175°COperatingTemperature  
Fast Switching  
V(BR)DSS  
55V  
17.5m  
49A  
RDS(on) max.  
ID  
Ω
G
Fully Avalanche Rated  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
Automotive Qualified *  
D
D
Description  
S
Specifically designed for Automotive applications, this  
Stripe Planar design of HEXFET® Power MOSFETs  
utilizes the latest processing techniques to achieve low  
on-resistance per silicon area. This benefit combined with  
the fast switching speed and ruggedized device design  
that HEXFET power MOSFETs are well known for,  
provides the designer with an extremely efficient and  
reliable device for use in Automotive and a wide variety  
of other applications.  
S
D
G
G
D2Pak  
TO-262  
AUIRFZ44NS  
AUIRFZ44NL  
G
Gate  
D
Drain  
S
Source  
Absolute Maximum Ratings  
StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated  
in the specifications is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect  
device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still  
air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
Max.  
49  
Units  
I
I
I
@ T = 25°C  
C
D
D
35  
@ T = 100°C  
A
C
160  
DM  
3.8  
P
P
@T = 25°C  
Power Dissipation  
D
D
A
W
94  
Power Dissipation  
@T = 25°C  
C
0.63  
±20  
Linear Derating Factor  
W/°C  
V
Gate-to-Source Voltage  
V
GS  
EAS (Thermally Limited)  
Single Pulse Avalanche Energy  
Single Pulse Avalanche Energy Tested Value  
150  
mJ  
EAS (tested)  
530  
IAR  
25  
Avalanche Current  
A
EAR  
dv/dt  
9.4  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
mJ  
5.0  
V/ns  
-55 to + 175  
T
T
J
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
STG  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
1.5  
Units  
RθJC  
RθJA  
Junction-to-Case  
Junction-to-Ambient  
°C/W  
–––  
40  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
08/29/11  

AUIRFZ44NSTRL 替代型号

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