PD - 96353
AUIRGB4062D
AUIRGP4062D
AUIRGP4062D-E
C
VCES = 600V
INSULATEDGATEBIPOLARTRANSISTORWITH
ULTRAFASTSOFTRECOVERYDIODE
IC = 24A, TC = 100°C
Features
• Low VCE (on) Trench IGBT Technology
• Low Switching Losses
• 5µs SCSOA
G
tSC ≥ 5µs, TJ(max) = 175°C
E
• Square RBSOA
VCE(on) typ. = 1.60V
• 100% of The Parts Tested for ILM
n-channel
• Positive VCE (on) Temperature Coefficient.
• Ultra Fast Soft Recovery Co-pak Diode
• Tighter Distribution of Parameters
•Lead-Free, RoHS Compliant
C
C
C
•Automotive Qualified *
E
Benefits
C
E
E
C
G
• High Efficiency in a Wide Range of Applications
• Suitable for a Wide Range of Switching Frequencies due
to Low VCE (ON) and Low Switching Losses
• Rugged Transient Performance for Increased Reliability
• Excellent Current Sharing in Parallel Operation
• Low EMI
C
G
G
TO-247AD
AUIRGP4062D-E
TO-247AC
AUIRGP4062D
TO-220AB
AUIRGB4062D
G
C
E
Gate
Collector
Emitter
AbsoluteMaximumRatings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied.Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified
Parameter
Max.
600
48
Units
VCES
C @ TC = 25°C
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulse Collector Current, VGE = 15V
V
I
IC @ TC = 100°C
24
72
ICM
ILM
Clamped Inductive Load Current, VGE = 20V
Diode Continous Forward Current
Diode Continous Forward Current
Diode Maximum Forward Current
96
A
IF @ TC = 25°C
48
24
IF @ TC = 100°C
IFM
96
Continuous Gate-to-Emitter Voltage
Transient Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
±20
±30
250
125
-55 to +175
V
VGE
PD @ TC = 25°C
W
P
D @ TC = 100°C
TJ
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting Torque, 6-32 or M3 Screw
°C
TSTG
300 (0.063 in. (1.6mm) from case)
10 lbf·in (1.1 N·m)
Thermal Resistance
Parameter
Min.
Typ.
–––
–––
–––
–––
0.50
0.24
62
Max.
Units
Thermal Resistance Junction-to-Case-(each IGBT) TO-220
Thermal Resistance Junction-to-Case-(each Diode) TO-220
Thermal Resistance Junction-to-Case-(each IGBT) TO-247
Thermal Resistance Junction-to-Case-(each Diode) TO-247
Thermal Resistance, Case-to-Sink (flat, greased surface)-TO-220
Thermal Resistance, Case-to-Sink (flat, greased surface)-TO-247
Thermal Resistance, Junction-to-Ambient (typical socket mount)-TO-220
Thermal Resistance, Junction-to-Ambient (typical socket mount)- TO-247
–––
–––
–––
–––
–––
0.60
1.53
0.65
1.62
–––
RθJC (IGBT)
RθJC (Diode)
RθJC (IGBT)
RθJC (Diode)
RθCS
°C/W
RθCS
RθJA
–––
–––
40
–––
RθJA
*Qualification standards can be found at http://www.irf.com/
1
www.irf.com
02/10/11