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AUIRFN8405

更新时间: 2024-11-06 01:18:43
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 573K
描述
Advanced Process Technology

AUIRFN8405 数据手册

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AUTOMOTIVE GRADE  
AUIRFN8405  
Features  
HEXFET® POWER MOSFET  
 Advanced Process Technology  
 Ultra Low On-Resistance  
 175°C Operating Temperature  
 Fast Switching  
 Repetitive Avalanche Allowed up to Tjmax  
 Lead-Free, RoHS Compliant  
 Automotive Qualified *  
VDSS  
40V  
1.6m  
2.0m  
187A  
95A  
RDS(on) typ.  
max  
ID (Silicon Limited)  
ID (Package Limited)  
Description  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
silicon area. Additional features of this design are a 175°C  
junction operating temperature, fast switching speed and  
improved repetitive avalanche rating. These features  
combine to make this product an extremely efficient and  
reliable device for use in Automotive and wide variety of  
other applications.  
PQFN 5X6 mm  
Applications  
 Electric Power Steering (EPS)  
 Battery Switch  
G
D
S
Gate  
Drain  
Source  
 Start/Stop Micro Hybrid  
 Heavy Loads  
 DC-DC Converter  
Standard Pack  
Base Part Number  
Package Type  
Orderable Part Number  
Form  
Tape and Reel  
Quantity  
AUIRFN8405  
PQFN 5mm x 6mm  
4000  
AUIRFN8405TR  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and  
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-  
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under  
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
Max.  
187  
132  
95  
670  
3.3  
Units  
ID @ TC(Bottom) = 25°C  
ID @ TC(Bottom) = 100°C  
ID @ TC = 25°C  
IDM  
PD @TA = 25°C  
PD @TC(Bottom) = 25°C  
A
Power Dissipation  
Power Dissipation  
W
136  
Linear Derating Factor  
Gate-to-Source Voltage  
0.022  
± 20  
W/°C  
V
VGS  
TJ  
TSTG  
Operating Junction and  
Storage Temperature Range  
-55 to + 175  
°C  
Avalanche Characteristics  
EAS(Thermally Limited)  
Single Pulse Avalanche Energy   
190  
365  
mJ  
EAS (Tested)  
Single Pulse Avalanche Energy  
Avalanche Current   
A
IAR  
See Fig. 14, 15, 22a, 22b  
mJ  
EAR  
Repetitive Avalanche Energy  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
1
www.irf.com © 2014 International Rectifier  
Submit Datasheet Feedback  
November 3, 2014  

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