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AUIRFN8459 PDF预览

AUIRFN8459

更新时间: 2023-09-03 20:36:32
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 534K
描述
40V 双 N 通道 HEXFET Power MOSFET, 采用 PQFN 5 x 6 L 封装

AUIRFN8459 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:QFN-8Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:1.7
其他特性:ULTRA LOW RESISTANCE雪崩能效等级(Eas):66 mJ
外壳连接:DRAIN配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:40 V最大漏极电流 (ID):50 A
最大漏源导通电阻:0.0059 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-F6湿度敏感等级:1
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):320 A参考标准:AEC-Q101
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

AUIRFN8459 数据手册

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AUTOMOTIVE GRADE  
AUIRFN8459  
Features  
VDSS  
RDS(on) typ.  
40V  
Advanced Process Technology  
Dual N-Channel MOSFET  
Ultra Low On-Resistance  
175°C Operating Temperature  
Fast Switching  
4.8m  
5.9m  
max  
ID (Silicon Limited)  
70A  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free, RoHS Compliant  
Automotive Qualified *  
ID (Package Limited)  
50A  
Description  
Specifically designed for Automotive applications, this HEXFET®  
Power MOSFET utilizes the latest processing techniques to  
achieve extremely low on-resistance per silicon area. Additional  
features of this design are a 175°C junction operating temperature,  
fast swithcing speed and improved repetitive avalanche rating.  
These features combine to make this product an extremely  
efficient and reliable device for use in Automotive and wide variety  
of other applications.  
DUAL PQFN 5X6 mm  
G
D
S
Applications  
Gate  
Drain  
Source  
12V Automotive Systems  
Brushed DC Motor  
Braking  
Transmission  
Base Part Number  
Package Type  
Standard Pack  
Form  
Tape and Reel  
Orderable Part Number  
Quantity  
4000  
AUIRFN8459  
Dual PQFN 5mm x 6mm  
AUIRFN8459TR  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and  
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-  
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under  
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 10V   
Continuous Drain Current, VGS @ 10V  
Max.  
70  
Units  
ID @ TC (Bottom) = 25°C  
ID @ TC (Bottom) = 100°C  
ID @ TC (Bottom) = 25°C  
IDM  
50  
A
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current   
50  
320  
Power Dissipation  
50  
W
PD @TC (Bottom) = 25°C  
Linear Derating Factor  
0.33  
W/°C  
V
VGS  
Gate-to-Source Voltage  
± 20  
mJ  
EAS  
Single Pulse Avalanche Energy (Thermally Limited)   
Single Pulse Avalanche Energy   
Avalanche Current   
66  
110  
EAS (Tested)  
A
IAR  
See Fig. 14, 15, 22a, 22b  
EAR  
TJ  
TSTG  
Repetitive Avalanche Energy   
Operating Junction and  
Storage Temperature Range  
-55 to + 175  
°C  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
51 www.irf.com © 2015 International Rectifier  
Submit Datasheet Feedback  
May 12, 2015  

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