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AUIRFP4568 PDF预览

AUIRFP4568

更新时间: 2024-09-28 20:07:11
品牌 Logo 应用领域
英飞凌 - INFINEON 局域网开关脉冲晶体管
页数 文件大小 规格书
12页 391K
描述
Power Field-Effect Transistor

AUIRFP4568 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:2.26
其他特性:ULTRA LOW RESISTANCE雪崩能效等级(Eas):763 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:150 V
最大漏极电流 (ID):171 A最大漏源导通电阻:0.0059 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-247AC
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):684 A
参考标准:AEC-Q101表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

AUIRFP4568 数据手册

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AUTOMOTIVE GRADE  
AUIRFP4568  
AUIRFP4568-E  
Features  
HEXFET® Power MOSFET  
l
l
l
l
l
l
l
l
Advanced Process Technology  
UltraLowOn-Resistance  
Dynamic dv/dt Rating  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
Automotive Qualified *  
D
VDSS  
150V  
RDS(on) typ.  
max.  
4.8m  
5.9m  
G
S
ID  
171A  
D
Description  
D
SpecificallydesignedforAutomotiveapplications,thisHEXFET®  
Power MOSFET utilizes the latest processing techniques to  
achieveextremelylowon-resistancepersiliconarea. Additional  
features of this design are a 175°C junction operating  
temperature, fast switching speed and improved repetitive  
avalanche rating . These features combine to make this design  
an extremely efficient and reliable device for use in Automotive  
S
S
D
D
G
G
TO-247AC  
TO-247AD  
AUIRFP4568  
AUIRFP4568-E  
applications and a wide variety of other applications.  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and  
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-  
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under  
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
Max.  
171  
121  
684  
517  
3.45  
± 30  
Units  
A
PD @TC = 25°C  
Maximum Power Dissipation  
Linear Derating Factor  
W
W/°C  
V
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy (Thermally Limited)  
Avalanche Current  
763  
mJ  
A
See Fig. 14, 15, 22a, 22b,  
Repetitive Avalanche Energy  
EAR  
dv/dt  
TJ  
mJ  
18.5  
Peak Diode Recovery  
V/ns  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
°C  
300  
10lbf in (1.1N m)  
Mounting torque, 6-32 or M3 screw  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.29  
–––  
40  
Units  
Rθ  
JC  
Rθ  
CS  
Rθ  
JA  
Junction-to-Case  
°C/W  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
0.24  
–––  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com © 2014 International Rectifier  
Submit Datasheet Feedback  
February 17, 2014  
1

AUIRFP4568 替代型号

型号 品牌 替代类型 描述 数据表
IRFP4568PBF INFINEON

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